We have demonstrated for the first time the permanent local modification of the bulk of silicon by repeated illumination with infrared (1.55 μm) picosecond pulses. Furthermore, we evaluated the characteristics of inscribing permanent modifications in the bulk material for different pulse durations from 0.8 to 10 ps in terms of their reproducibility and controllability of their morphology. Our results are based on a simple experimental setup that demonstrates the possibility of using picosecond pulses for the local modification of bulk silicon as a potential alternative to more complex irradiation strategies required for femtosecond pulse processing
11th ASME International Manufacturing Science and Engineering Conference (MSEC 2016), Blacksburg, VA...
Decreasing film thicknesses and sizes of microstructures require an ultraprecise removal of the mate...
Laser-induced damage morphology using femtosecond laser pulses on Si surfaces is reported. Damage mo...
International audienceWe have demonstrated for the first time the permanent local modification of th...
International audienceThe advent of ultrafast infrared lasers provides a unique opportunity for dire...
The modification of bulk-silicon is realized today with infrared nanosecond lasers.However, the regi...
Laser ablation and modification using bursts of picosecond pulses and a tightly focused laser beam a...
Morphology changes introduced by picosecond laser pulses at λ = 532 nm and 355 nm in (111) and (100)...
International audienceWe report on the refractive index engineering inside silicon bulk by picosecon...
This paper reports the surface morphologies and ablation of crystalline silicon wafers irradiated by...
We have analyzed the effects of the laser pulse wavelength (400 nm) on femtosecond laser surface st...
International audienceRecent demonstrations of internal structuring of silicon have open new perspec...
In a competitive industry, efficiency of material processing must constantly increase, so various me...
International audienceThree-dimensional laser writing inside silicon remains today inaccessible with...
Three-dimensional laser writing inside silicon remains today inaccessible with the shortest infrared...
11th ASME International Manufacturing Science and Engineering Conference (MSEC 2016), Blacksburg, VA...
Decreasing film thicknesses and sizes of microstructures require an ultraprecise removal of the mate...
Laser-induced damage morphology using femtosecond laser pulses on Si surfaces is reported. Damage mo...
International audienceWe have demonstrated for the first time the permanent local modification of th...
International audienceThe advent of ultrafast infrared lasers provides a unique opportunity for dire...
The modification of bulk-silicon is realized today with infrared nanosecond lasers.However, the regi...
Laser ablation and modification using bursts of picosecond pulses and a tightly focused laser beam a...
Morphology changes introduced by picosecond laser pulses at λ = 532 nm and 355 nm in (111) and (100)...
International audienceWe report on the refractive index engineering inside silicon bulk by picosecon...
This paper reports the surface morphologies and ablation of crystalline silicon wafers irradiated by...
We have analyzed the effects of the laser pulse wavelength (400 nm) on femtosecond laser surface st...
International audienceRecent demonstrations of internal structuring of silicon have open new perspec...
In a competitive industry, efficiency of material processing must constantly increase, so various me...
International audienceThree-dimensional laser writing inside silicon remains today inaccessible with...
Three-dimensional laser writing inside silicon remains today inaccessible with the shortest infrared...
11th ASME International Manufacturing Science and Engineering Conference (MSEC 2016), Blacksburg, VA...
Decreasing film thicknesses and sizes of microstructures require an ultraprecise removal of the mate...
Laser-induced damage morphology using femtosecond laser pulses on Si surfaces is reported. Damage mo...