International audienceIn this paper, an enhanced compact model of multiwalled carbon nanotube (MWCNT) interconnects while considering defects and contact resistance is proposed. Based on the atomistic-level simulations, we have found that defect densities impact MWCNT resistance and ultimately their electrical performance. Furthermore, we have computed by atomistic-level simulations, the end-contact resistance between single-wall carbon nanotube and palladium (Pd) electrode to mimic the Pd-CNT end-contact resistance of each CNT shell in MWCNT. We have developed an advanced shell-by-shell model to include various parameters, such as shell diameter, shell chirality, defects on each shell, and connectivity of each shell to end contacts. We run...
Electrical transport properties of individual multiwalled carbon nanotubes (MWCNTs) with diameters g...
The burgeoning demand for nanotechnology presents a specific issue in that it requires the productio...
To realize carbon nanotube (CNT) as on-chip interconnect materials, the contact resistance stemming ...
International audienceIn this paper, an enhanced compact model of multiwalled carbon nanotube (MWCNT...
International audienceIn this paper, an enhanced compact model of multiwalled carbon nanotube (MWCNT...
International audienceIn this paper, the impact of charge transfer doping on the variability of mult...
International audienceIn this article, we present a hierarchical model for doped single-wall carbon ...
In this article, we present a hierarchical model for doped single-wall carbon nanotube (SWCNT) for o...
International audienceWe have performed statistical atomistic simulations with tight-binding approac...
In this paper, we investigate, by combining electrical measurements with an atomistic-To-circuit mod...
Abstract This theoretical study focuses on junctions between the carbon nanotubes (CN...
In this paper, we investigate, by combining electrical measurements with an atomistic-to-circuit mod...
Abstract—Metallic carbon nanotubes (CNTs) have received much attention for their unique characterist...
Multiwall carbon nanotube (MWCNT)-based interconnects have been shown to outperform conventional met...
Carbon nanotubes (CNTs) due to their high electrical/thermal conductivity, high ampacity, high toler...
Electrical transport properties of individual multiwalled carbon nanotubes (MWCNTs) with diameters g...
The burgeoning demand for nanotechnology presents a specific issue in that it requires the productio...
To realize carbon nanotube (CNT) as on-chip interconnect materials, the contact resistance stemming ...
International audienceIn this paper, an enhanced compact model of multiwalled carbon nanotube (MWCNT...
International audienceIn this paper, an enhanced compact model of multiwalled carbon nanotube (MWCNT...
International audienceIn this paper, the impact of charge transfer doping on the variability of mult...
International audienceIn this article, we present a hierarchical model for doped single-wall carbon ...
In this article, we present a hierarchical model for doped single-wall carbon nanotube (SWCNT) for o...
International audienceWe have performed statistical atomistic simulations with tight-binding approac...
In this paper, we investigate, by combining electrical measurements with an atomistic-To-circuit mod...
Abstract This theoretical study focuses on junctions between the carbon nanotubes (CN...
In this paper, we investigate, by combining electrical measurements with an atomistic-to-circuit mod...
Abstract—Metallic carbon nanotubes (CNTs) have received much attention for their unique characterist...
Multiwall carbon nanotube (MWCNT)-based interconnects have been shown to outperform conventional met...
Carbon nanotubes (CNTs) due to their high electrical/thermal conductivity, high ampacity, high toler...
Electrical transport properties of individual multiwalled carbon nanotubes (MWCNTs) with diameters g...
The burgeoning demand for nanotechnology presents a specific issue in that it requires the productio...
To realize carbon nanotube (CNT) as on-chip interconnect materials, the contact resistance stemming ...