Electrochemical behavior of Ni-P-SiC composite coatings: effect of heat treatment and SiC particle incorporation

This paper describes the effects of heat treatment and of SiC particle incorporation on the electrochemical behavior and physical structure of Ni[BOND]P (17 at% P) composite coatings. The deposits were obtained by electrodeposition with various contents of SiC particles in the plating bath and heat treated at 420 °C. The physical structure was investigated by inductively coupled plasma atomic emission spectrometry (ICP-AES), X-ray diffraction (XRD), and scanning electron microscopy (SEM - image analysis). The electrochemical behavior of the resultant composite coatings was determined by chronopotentiometry, electrochemical impedance spectroscopy, and potentiodynamic measurements in 0.6 M NaCl solution at pH 6. Heat treatment showed a positive effect on the electrochemical behavior of Ni[BOND]P coatings, shifting the open circuit potential toward less active potentials. The incorporation of SiC particles inhibited pit nucleation on the Ni[BOND]P composite coating, with or without post-heat treatment. However, heat treatment in the Ni[BOND]P[BOND]SiC seemed to induce cracks in the metallic matrix, initiating at the SiC particles, possibly caused by the contraction in the metallic matrix. The cracked structure promoted localized corrosion, while coatings without heat treatment resulted in a general and uniform corrosion