The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and vapor chambers is limited by the capabilities of the capillary wick structures employed. The desired characteristics of wick microstructures are high permeability, high wicking capability and large extended meniscus area that sustains thin-film evaporation. Choices of scale and porosity of wick structures lead to trade-offs between the desired characteristics. In the present work, models are developed to predict the capillary pressure, permeability and thin-film evaporation rates of various micropillared geometries. Novel wicking geometries such as conical and pyramidal pillars on a surface are proposed which provide high permeability, good ...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017.Ca...
Micro-post wick is a promising candidate for high-heat-flux applications due to its compatibility, h...
The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and...
The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and...
The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and...
The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and...
Heat pipes and vapor chambers act as efficient heat spreaders since they rely on phase change of the...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
Thin, low-profile phase change thermal spreaders can provide cooling solutions for some of today's m...
Thin-film evaporation in wick structures for cooling high-performance electronic devices is attracti...
A numerical model is developed for the evaporating liquid meniscus in wick microstructures under sat...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017.Ca...
Micro-post wick is a promising candidate for high-heat-flux applications due to its compatibility, h...
The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and...
The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and...
The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and...
The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and...
Heat pipes and vapor chambers act as efficient heat spreaders since they rely on phase change of the...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
Thin, low-profile phase change thermal spreaders can provide cooling solutions for some of today's m...
Thin-film evaporation in wick structures for cooling high-performance electronic devices is attracti...
A numerical model is developed for the evaporating liquid meniscus in wick microstructures under sat...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
The topology and geometry of microstructures play a crucial role in determining their heat transfer ...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017.Ca...
Micro-post wick is a promising candidate for high-heat-flux applications due to its compatibility, h...