Pool boiling heat transfer is measured with two individual working fluids on copper surfaces enhanced with sintered copper powder and carbon nanotubes. The working fluids are a segregated hydrofluoroether, HFE-7300 (3M Electronic Markets Materials Division, St. Paul, MN), and deionized water. The surfaces considered in the experiments include smooth copper, copper with sintered copper particles, smooth copper with copper-coated carbon nanotubes (CNT), and copper with sintered copper particles and copper-coated carbon nanotubes. Characteristics of the resulting boiling curves are discussed and analyzed. Lower wall superheats resulted from both the sintered particles and the CNT array for both working fluids. For water, there was no additiona...
The subcooling effect on pool boiling heat transfer using a copper microporous coating was experimen...
This paper reports an experimental investigation of the pool boiling heat transfer characteristics o...
In the present study, an electrophoretic deposition method was employed to modify copper surfaces wi...
Pool boiling heat transfer is measured with two individual working fluids on copper surfaces enhance...
Experiments were performed to assess the impact coating silicon and copper substrates with nanotubes...
Boiling is an essential process for many industrial applications such as refrigeration, distillation...
The article describes the study of heat transfer during pool boiling on minifins surface coated with...
This study investigated the heat transfer performance of three nanostructured surfaces and two plain...
Miniaturization in microelectronics demands effective thermal management from high energy density de...
Experiments were performed to evaluate the effect of carbon nanotubes (CNT) coatings on silicon surf...
The enhancement of pool boiling heat transfer by copper-particle surface coatings is experimentally ...
Pool boiling heat-transfer measurements were made using a 15.8 mm o.d. plain copper tube and three c...
Progress in integrated circuit technology has caused device density and power dissipation to increas...
Saturated pool boiling heat transfer is investigated experimentally on a copper substrate with coppe...
International audienceIn the present paper, experiments have been performed to highlight the influen...
The subcooling effect on pool boiling heat transfer using a copper microporous coating was experimen...
This paper reports an experimental investigation of the pool boiling heat transfer characteristics o...
In the present study, an electrophoretic deposition method was employed to modify copper surfaces wi...
Pool boiling heat transfer is measured with two individual working fluids on copper surfaces enhance...
Experiments were performed to assess the impact coating silicon and copper substrates with nanotubes...
Boiling is an essential process for many industrial applications such as refrigeration, distillation...
The article describes the study of heat transfer during pool boiling on minifins surface coated with...
This study investigated the heat transfer performance of three nanostructured surfaces and two plain...
Miniaturization in microelectronics demands effective thermal management from high energy density de...
Experiments were performed to evaluate the effect of carbon nanotubes (CNT) coatings on silicon surf...
The enhancement of pool boiling heat transfer by copper-particle surface coatings is experimentally ...
Pool boiling heat-transfer measurements were made using a 15.8 mm o.d. plain copper tube and three c...
Progress in integrated circuit technology has caused device density and power dissipation to increas...
Saturated pool boiling heat transfer is investigated experimentally on a copper substrate with coppe...
International audienceIn the present paper, experiments have been performed to highlight the influen...
The subcooling effect on pool boiling heat transfer using a copper microporous coating was experimen...
This paper reports an experimental investigation of the pool boiling heat transfer characteristics o...
In the present study, an electrophoretic deposition method was employed to modify copper surfaces wi...