Multiwall carbon nanotube (MWCNT)-based interconnects have been shown to outperform conventional metal interconnects. For reliable operation of such interconnects, it is imperative to evaluate their reliability at possible fatal events. Here, we report the ESD reliability of MWCNT-based interconnects. High failure current of similar to 10 mA and unique failure behavior involving discrete and gradual breakdown of individual shells is reported. It was found that MWCNT interconnects change resistance in steps of fundamental quantum resistance (h/2e(2)) after individual shell burning. The role of individual shells, diameter, and resistance of the tube in deciding the ESD behavior is investigated, while monitoring the response on a shell-by-shel...
International audienceIn this paper, the impact of charge transfer doping on the variability of mult...
The high-current carrying capacity of Multi-walled Carbon Nanotubes (MWCNTs) is the central idea beh...
The continuous downward scaling in integrated circuit (IC) technologies has led to rapid shrinking o...
Multiwall carbon nanotube (MWCNT)-based interconnects have been shown to outperform conventional met...
ESD behavior of metallic carbon nanotubes (CNTs) is explored. Unique TLP I-V characteristics and fai...
Electrostatic discharge (ESD) investigations on the multiwalled carbon nanotubes (MWCNTs) are perfor...
High-current carrying capacity and superior thermal conductivity have made multiwall carbon nanotube...
In this work, for the first time we experimentally determine ESD behavior of individual shells of bo...
International audienceIn this paper, an enhanced compact model of multiwalled carbon nanotube (MWCNT...
International audienceIn this paper, an enhanced compact model of multiwalled carbon nanotube (MWCNT...
Electrical transport properties of individual multiwalled carbon nanotubes (MWCNTs) with diameters g...
We have investigated electrical transport properties of long (>10 mu m) multiwalled carbon nanotubes...
The current through a multiwalled carbon nanotube (MWCNT) was measured as a function of time at high...
Weakly interacting graphitic shells of different resistivities within multiwalled carbon nanotubes (...
The progress on novel interconnects for carbon nanotube (CNT)-based electronic circuit is by far beh...
International audienceIn this paper, the impact of charge transfer doping on the variability of mult...
The high-current carrying capacity of Multi-walled Carbon Nanotubes (MWCNTs) is the central idea beh...
The continuous downward scaling in integrated circuit (IC) technologies has led to rapid shrinking o...
Multiwall carbon nanotube (MWCNT)-based interconnects have been shown to outperform conventional met...
ESD behavior of metallic carbon nanotubes (CNTs) is explored. Unique TLP I-V characteristics and fai...
Electrostatic discharge (ESD) investigations on the multiwalled carbon nanotubes (MWCNTs) are perfor...
High-current carrying capacity and superior thermal conductivity have made multiwall carbon nanotube...
In this work, for the first time we experimentally determine ESD behavior of individual shells of bo...
International audienceIn this paper, an enhanced compact model of multiwalled carbon nanotube (MWCNT...
International audienceIn this paper, an enhanced compact model of multiwalled carbon nanotube (MWCNT...
Electrical transport properties of individual multiwalled carbon nanotubes (MWCNTs) with diameters g...
We have investigated electrical transport properties of long (>10 mu m) multiwalled carbon nanotubes...
The current through a multiwalled carbon nanotube (MWCNT) was measured as a function of time at high...
Weakly interacting graphitic shells of different resistivities within multiwalled carbon nanotubes (...
The progress on novel interconnects for carbon nanotube (CNT)-based electronic circuit is by far beh...
International audienceIn this paper, the impact of charge transfer doping on the variability of mult...
The high-current carrying capacity of Multi-walled Carbon Nanotubes (MWCNTs) is the central idea beh...
The continuous downward scaling in integrated circuit (IC) technologies has led to rapid shrinking o...