The aim of this work is to develop and optimize processing technologies required for 3-D die level packaging of hybrid systems including MEMS and MOS components. In this paper we report the process development for stacking of ultra-thin silicon dies (as low as 10 mu m) and a basic 5 mu m thick MEMS device (Cantilever). SU-8 has been used as the patternable dielectric filler between the device layers
The world has seen an unrivaled spread of semiconductor technology into virtually any part of societ...
The scope of the European project TIPS (Thin Interconnected Package Stacks) is the fabrication of ul...
The scope of the European project TIPS (Thin Interconnected Package Stacks) is the fabrication of ul...
The aim of this work is to develop and optimize processing technologies required for 3-D die level p...
Continuous increase in demand for product miniaturization, high package density, high performance an...
Heterogeneous integration bridges the gap between nanoelectronics and its derived applications. Curr...
3D integration of micro electromechanical systems (MEMS) and integrated circuits (ICs) represents a ...
AbstractThe presented fabrication technology enables the direct integration of electrical interconne...
3D-stacking of Ultra Thin Chip Packages (UTCP’s) – one of the emerging technologies in the field of ...
3D-stacking of Ultra Thin Chip Packages (UTCP’s) – one of the emerging technologies in the field of ...
The scope of the European project TIPS (Thin Interconnected Package Stacks) is the fabrication of ul...
Advanced packaging technologies open new perspectives for system designers. Fan-in/out wafer level p...
3D integration of micro electromechanical systems (MEMS) is expected to reduce the foot print of exi...
This paper shows different approaches to use the availability of ultrathin chips for the realization...
Two embedded micro wafer level packages (EMWLP) with (1) laterally placed and (2) vertically stacked...
The world has seen an unrivaled spread of semiconductor technology into virtually any part of societ...
The scope of the European project TIPS (Thin Interconnected Package Stacks) is the fabrication of ul...
The scope of the European project TIPS (Thin Interconnected Package Stacks) is the fabrication of ul...
The aim of this work is to develop and optimize processing technologies required for 3-D die level p...
Continuous increase in demand for product miniaturization, high package density, high performance an...
Heterogeneous integration bridges the gap between nanoelectronics and its derived applications. Curr...
3D integration of micro electromechanical systems (MEMS) and integrated circuits (ICs) represents a ...
AbstractThe presented fabrication technology enables the direct integration of electrical interconne...
3D-stacking of Ultra Thin Chip Packages (UTCP’s) – one of the emerging technologies in the field of ...
3D-stacking of Ultra Thin Chip Packages (UTCP’s) – one of the emerging technologies in the field of ...
The scope of the European project TIPS (Thin Interconnected Package Stacks) is the fabrication of ul...
Advanced packaging technologies open new perspectives for system designers. Fan-in/out wafer level p...
3D integration of micro electromechanical systems (MEMS) is expected to reduce the foot print of exi...
This paper shows different approaches to use the availability of ultrathin chips for the realization...
Two embedded micro wafer level packages (EMWLP) with (1) laterally placed and (2) vertically stacked...
The world has seen an unrivaled spread of semiconductor technology into virtually any part of societ...
The scope of the European project TIPS (Thin Interconnected Package Stacks) is the fabrication of ul...
The scope of the European project TIPS (Thin Interconnected Package Stacks) is the fabrication of ul...
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