Modelling the Effect of Residual Stress and Perforations on the Dynamic Characteristics of MEMS Devices

Determination of dynamic characteristics of MEMS devices critically depends on accurate measurements of natural frequency and damping in the device. The natural frequency and damping on fabrication process dependent residual stress other than the usual design parameters of the structure. Similarly, perforations provided in the structure for etching purpose have profound effect on the squeeze film damping of the device. In this paper, we first experimentally determine the natural frequency and squeeze film damping in a MEMS device, and then present theoretical calculations for computing these quantities that include the effect of residual stress and perforation