© 2014 Copyright © Taylor & Francis Group, LLC. The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanoparticles at 240°C and 5 MPa for 3 to 17 minutes. Their microstructural features were quantitatively characterized with scanning electronic microscopy, transmission electron microscopy, X-ray diffraction and image analysis method. The resulting normalized thickness, pore size and porosity decreased, and grain size increased with increasing the sintering time. A time dependence of the form t1/n with n close to 2 or 3 can be further derived for the kinetics of the thinning, densification and grain growth within the sintered Ag joints
This study focused on the time-reduced sintering process of nanosilver film and power cycling reliab...
Low-temperature joining with sintered silver is being developed as a lead-free, non-solder, die-atta...
Power electronic systems are needed in diverse areas such as electricity transmission or electrical ...
The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanopart...
Nowadays, numerous power electronics application requires operation at high temperatures. In order t...
This study investigates the power cycling reliability of nanosilver sintered joints formed by a time...
13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepar...
Pressure-assisted sintering processes to attach power devices using wet nanosilver pastes with time ...
3 mm × 3 mm dummy SiC dies with 100\200\200 nm thick Ti\W\Au metallization have simultaneously been ...
Abstract3mm×3mm dummy SiC dies with 100\200\200nm thick Ti\W\Au metallization have simultaneously be...
Pressure-assisted sintering processes to attach power devices using wet nanosilver pastes with time ...
In this paper, the microstructure of Ag nano paste joint was investigated in pressure-less sintering...
Nano-Ag paste is one of the most widely used die-attachment materials in modern electronic devices, ...
For decades soldering has been the technology of choice in die bonding. However, due to worldwide he...
13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepar...
This study focused on the time-reduced sintering process of nanosilver film and power cycling reliab...
Low-temperature joining with sintered silver is being developed as a lead-free, non-solder, die-atta...
Power electronic systems are needed in diverse areas such as electricity transmission or electrical ...
The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanopart...
Nowadays, numerous power electronics application requires operation at high temperatures. In order t...
This study investigates the power cycling reliability of nanosilver sintered joints formed by a time...
13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepar...
Pressure-assisted sintering processes to attach power devices using wet nanosilver pastes with time ...
3 mm × 3 mm dummy SiC dies with 100\200\200 nm thick Ti\W\Au metallization have simultaneously been ...
Abstract3mm×3mm dummy SiC dies with 100\200\200nm thick Ti\W\Au metallization have simultaneously be...
Pressure-assisted sintering processes to attach power devices using wet nanosilver pastes with time ...
In this paper, the microstructure of Ag nano paste joint was investigated in pressure-less sintering...
Nano-Ag paste is one of the most widely used die-attachment materials in modern electronic devices, ...
For decades soldering has been the technology of choice in die bonding. However, due to worldwide he...
13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepar...
This study focused on the time-reduced sintering process of nanosilver film and power cycling reliab...
Low-temperature joining with sintered silver is being developed as a lead-free, non-solder, die-atta...
Power electronic systems are needed in diverse areas such as electricity transmission or electrical ...