A facile route to mitigate the Fermi-level pinning between a p-type GaSb semiconductor and an Al2O3 dielectric is proposed. Combination of the sulphurization of the GaSb surface and the subsequent rapid thermal annealing allowed for high quality GaSb/Al2O3 interfacial characteristics; the interfacial trap density value was <= 2.0 x 10(12) cm(-2) eV(-1) in an energy range of 0.05 <= E-T - E-v <= 0.45 eV for the PMOS capacitor via rapid thermal annealing at 575 degrees C. A physical rationale was given on the basis of the thermo-chemical conversion of Ga2O into Ga2O3 and the conformal elimination of Sb related elements and oxides on the GaSb surface. Published by AIP Publishing.This study was supported by the National Research Founda...
Numerous metal oxides have been studied worldwide as possible high-k gate dielectric candidates for ...
The study on post metallization annealing (PMA) in electrical characteristics and interfacial proper...
This study reports the impact of forming gas annealing (FGA) on the electrical characteristics of su...
III-V materials have emerged as potential candidates to replace silicon in metal-oxide-semiconductor...
[[abstract]]Ga2O3(Gd2O3), a high kappa gate dielectric, ultrahigh vacuum (UHV)-deposited on GaAs and...
The integration of high carrier mobility materials into future CMOS generations is presently being s...
In this work, we report the impact of forming gas annealing (H2 : N2 5%:95% at 350C for 30 minutes)...
An interface characterization of p-type GaSb metal-oxide-semiconductor (MOS) structures has been per...
The GaSb surface was exposed to various HCl-based chemical treatments in order to prepare it for hig...
International audienceTo overcome the Fermi-level pinning in III-V metal-oxide-semiconductor capacit...
International audienceIn this work, the Al2O3/GaSb interface has been studied by x-ray photoelectron...
The high interfacial trap density in GaAs MOS capacitors is one of the critical issues for realizing...
layer-deposited (ALD) Al2O3 as gate dielectric are demonstrated. A 0.75-μm-gate-length device has a ...
As a promising candidate channel material for PMOS mobility enhancement for next generation CMOS tec...
In this work, the impact of ammonium sulfide ((NH4)(2)S) surface treatment on the electrical passiva...
Numerous metal oxides have been studied worldwide as possible high-k gate dielectric candidates for ...
The study on post metallization annealing (PMA) in electrical characteristics and interfacial proper...
This study reports the impact of forming gas annealing (FGA) on the electrical characteristics of su...
III-V materials have emerged as potential candidates to replace silicon in metal-oxide-semiconductor...
[[abstract]]Ga2O3(Gd2O3), a high kappa gate dielectric, ultrahigh vacuum (UHV)-deposited on GaAs and...
The integration of high carrier mobility materials into future CMOS generations is presently being s...
In this work, we report the impact of forming gas annealing (H2 : N2 5%:95% at 350C for 30 minutes)...
An interface characterization of p-type GaSb metal-oxide-semiconductor (MOS) structures has been per...
The GaSb surface was exposed to various HCl-based chemical treatments in order to prepare it for hig...
International audienceTo overcome the Fermi-level pinning in III-V metal-oxide-semiconductor capacit...
International audienceIn this work, the Al2O3/GaSb interface has been studied by x-ray photoelectron...
The high interfacial trap density in GaAs MOS capacitors is one of the critical issues for realizing...
layer-deposited (ALD) Al2O3 as gate dielectric are demonstrated. A 0.75-μm-gate-length device has a ...
As a promising candidate channel material for PMOS mobility enhancement for next generation CMOS tec...
In this work, the impact of ammonium sulfide ((NH4)(2)S) surface treatment on the electrical passiva...
Numerous metal oxides have been studied worldwide as possible high-k gate dielectric candidates for ...
The study on post metallization annealing (PMA) in electrical characteristics and interfacial proper...
This study reports the impact of forming gas annealing (FGA) on the electrical characteristics of su...