采用纳米银焊膏烧结互连技术的中高压IGBT模块及其性能表征

<p>Interface contact through pressure is the way for press-pack insulated gate bipolar transistor (IGBT) modules in smart grid to conduct heat dissipation. However, the junction temperature of the press-pack IGBT modules could be too high, leading to degradation of electrical properties and even impairing the reliability, because of poor interfacial contact and poor heat dissipation. To overcome the above problems, we developed a sinter-pack IGBT module using nanosilver paste by forming electrical contact with chip to replace pressure contact in press-pack module. Then, the sinter-pack module was characterized by die-shear strength, thermal resistance, and static characteristics to compare with press-pack IGBT module. According to the experimental results, the thermal resistance of sinter-pack IGBT module decreased by 15.8%. The static electricity test results are consistent with two types of modules, further proving the feasibility of sinter-pack IGBT modules. The shear strength is around 20 MPa, indicating a good bonding quality of large area of die (13.5 mm&times;13.5 mm) with nanosiver paste. It is concluded that nano silver paste employed in press-pack IGBT modules can not only significantly decrease the thermal resistance of press-pack IGBT modules, but also get an excellent static electricity. Thus, a sinter-pack module is expected to be operated in smart grid because of the higher conversion efficiency, power density, and reliability during operating at high voltage and current applications. &copy; 2017, High Voltage Engineering Editorial Department of CEPRI. All right reserved.</p> <p>&nbsp;