Eugenol-based Organic Silicone Epoxy Resin and Its Curing Kinetics

In this paper, a novel bio-based silicone epoxy resin, 1,3-bis(3-(3-methoxy-4-(oxiran-2-.ylinethoxy)phenyl)propy0-1,1,3,3-tetramethyldisiloxane (HMSEEP), was prepared using bio-based monomer, eugenol, as the raw material. Then, 4,4'-diaminophenyi methane (DDM) and two polyetheramine curing agents, D230 and D400, were applied to, cure the HMSEEP. The bisphenol A type epoxy resin (DGEBA) was also cured and tested the same as the HMSEEP. The results of H-1-NMR and FTIR indicated that the bio-based silicone epoxy resin was successfully prepared. Moreover, the curing kinetics of the HMSEEP and DGEBA were investigated by using Kissinger method. HMSEEP had excellent thermal stability and showed no weight loss below 200 degrees C, and the carbon residue of the HMSEEP at 600 degrees C was also higher than that of the DGEBA