The microporous corrosion is the main surface failure mechanism of gold-plated components. The microporous corrosion behavior of electroless nickel and immersion gold (ENIG)-plated printed circuit boards (PCBs) in Turpan area which has an atmospheric environment with high salinity was investigated via a field exposure method for 24 months, as well as 3D analysis, FIB technology, composition analysis, and electrochemical impedance spectroscopy and corrosion mechanism model. After 6 months of exposure, the corrosion products filled up the pores and clustered on the surface as mound shape, and a possible corrosion mechanism model was displayed in the study after 24 months of exposure. The results showed that PCB-ENIG mainly suffered microporou...
AbstractThe petroleum industry and desalination plants suffer from marine bio-fouling problems that ...
The electrochemical migration (ECM) mechanism occurs at the presence of moisture in the case of op...
Under certain environmental conditions, printed wiring boards (PWB) respond to applied voltages by d...
The microporous corrosion is the main surface failure mechanism of gold-plated components. The micro...
The electrochemical corrosion behavior of a silver-plated circuit board (PCB-ImAg) in a polluted mar...
The effects of relative humidity (RH) on a printed circuit board finished with electroless nickel im...
This experiment was carried out in Wheat Island Qingdao which is characterized with a typical indust...
The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel...
The climate in Turpan is perennial drought with little rainfall, which usually results in the corros...
Corrosion of electronic systems has been a significant issue in electronic industry nowadays. One of...
Electroless nickel (Ni) immersion gold (Au), commonly referred to by the acronym ENIG, is the most c...
Since the early 70s, printed circuit boards (PCBs) are firmly entrenched in all electronic branches,...
This paper presents and discusses the results for electrochemical corrosion testing in comparison to...
Atmospheric corrosion may cause serious damage to metallic structures and equipments. Because of the...
The electronics industry has observed an increase in the incidents of corrosion failures in data cen...
AbstractThe petroleum industry and desalination plants suffer from marine bio-fouling problems that ...
The electrochemical migration (ECM) mechanism occurs at the presence of moisture in the case of op...
Under certain environmental conditions, printed wiring boards (PWB) respond to applied voltages by d...
The microporous corrosion is the main surface failure mechanism of gold-plated components. The micro...
The electrochemical corrosion behavior of a silver-plated circuit board (PCB-ImAg) in a polluted mar...
The effects of relative humidity (RH) on a printed circuit board finished with electroless nickel im...
This experiment was carried out in Wheat Island Qingdao which is characterized with a typical indust...
The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel...
The climate in Turpan is perennial drought with little rainfall, which usually results in the corros...
Corrosion of electronic systems has been a significant issue in electronic industry nowadays. One of...
Electroless nickel (Ni) immersion gold (Au), commonly referred to by the acronym ENIG, is the most c...
Since the early 70s, printed circuit boards (PCBs) are firmly entrenched in all electronic branches,...
This paper presents and discusses the results for electrochemical corrosion testing in comparison to...
Atmospheric corrosion may cause serious damage to metallic structures and equipments. Because of the...
The electronics industry has observed an increase in the incidents of corrosion failures in data cen...
AbstractThe petroleum industry and desalination plants suffer from marine bio-fouling problems that ...
The electrochemical migration (ECM) mechanism occurs at the presence of moisture in the case of op...
Under certain environmental conditions, printed wiring boards (PWB) respond to applied voltages by d...