In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating a relatively low content of one-dimensional carbon nanotubes (CNTs; 0.0005-0.25 vol %) and a certain content of two-dimensional boron nitride (BN; 30 phr) in a silicone rubber (SIR) matrix. As indicated by transmission electron microscopy observation, flexible CNTs can serve as bridges to connect BN platelets in different layers to form hybrid 3D thermally conductive networks; this results in an increase in thermally conductive pathways, and the isolation between CNTs can prevent the formation of electrically conductive networks. Compared to the SIR-BN composite with the same BN content, the SIR-BN-CNT composites exhibited improved thermal co...
Developing polymer-based nanocomposites with high thermal conductivity, mechanical performance, and ...
Epoxy as a type of matrix material has been extensively applied for printed circuit boards (PCBs) an...
Epoxy/cyanate resin matrix composites (AG80/CE) with improved thermal conductivity and mechanical pr...
This study suggests the simple and effective synthesis method of chemically interconnected hexagonal...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
To solve the problem of excessive heat accumulation in the electronic packaging field, a novel serie...
This work placed an emphasis that constructing segregated boron nitride (BN)/carbon nanotube (CNT) h...
Effective heat dissipation has become a critical issue for electronic devices. In this study, the si...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
The heat accumulation has become a serious problem due to electronic devices towards high power and ...
This work is focused on developing an epoxy-based hybrid composite using BN and VGCNF, with the main...
Abstract Boron nitride (BN) has attracted increasing attention as a filler using in insulating mater...
With the advent of the 5G era, hexagonal boron nitride (BN) platelets are ideal fillers to incorpora...
The demand for wearable electronics has resulted in an increasing interest in the development of fun...
In order to improve the thermal conductivity of 30 wt % synthetic graphite (SG)-filled polyketones (...
Developing polymer-based nanocomposites with high thermal conductivity, mechanical performance, and ...
Epoxy as a type of matrix material has been extensively applied for printed circuit boards (PCBs) an...
Epoxy/cyanate resin matrix composites (AG80/CE) with improved thermal conductivity and mechanical pr...
This study suggests the simple and effective synthesis method of chemically interconnected hexagonal...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
To solve the problem of excessive heat accumulation in the electronic packaging field, a novel serie...
This work placed an emphasis that constructing segregated boron nitride (BN)/carbon nanotube (CNT) h...
Effective heat dissipation has become a critical issue for electronic devices. In this study, the si...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
The heat accumulation has become a serious problem due to electronic devices towards high power and ...
This work is focused on developing an epoxy-based hybrid composite using BN and VGCNF, with the main...
Abstract Boron nitride (BN) has attracted increasing attention as a filler using in insulating mater...
With the advent of the 5G era, hexagonal boron nitride (BN) platelets are ideal fillers to incorpora...
The demand for wearable electronics has resulted in an increasing interest in the development of fun...
In order to improve the thermal conductivity of 30 wt % synthetic graphite (SG)-filled polyketones (...
Developing polymer-based nanocomposites with high thermal conductivity, mechanical performance, and ...
Epoxy as a type of matrix material has been extensively applied for printed circuit boards (PCBs) an...
Epoxy/cyanate resin matrix composites (AG80/CE) with improved thermal conductivity and mechanical pr...