The new mechatronic technologies can significantly reduce the energy consumption and gas emissions of personal cars, by introducing rupture innovations in electrified powertrains complementarily or alternatively to combustion engines. The power electronics assemblies used in starter-alternator systems use solder joints which need to be substituted with lead-free solder in agreements with international standards. This thesis contributes to the metallurgical and mechanical characterization of two tin-based lead-free solder joints. These joints are produced industrially with a Die Laser Soldering process which leads to heterogeneous solidification microstructures, poorly reproducible, multiphased, and with defects. The objective of this thesi...
Solder joints serve as both mechanical and electrical connections between elements in a package. The...
The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliabil...
A solid-state diffusion bonding technology, called thermodiffusion, has been developed to miniaturiz...
The new mechatronic technologies can significantly reduce the energy consumption and gas emissions o...
The new mechatronic technologies can significantly reduce the energy consumption and gas emissions o...
Les nouvelles technologies mécatroniques permettent de réduire fortement la consommation d'énergie e...
Nowadays, SAC alloys are widely used as soldering materials. The SAC solder joints have a dynamic mi...
The thesis focuses on the study of the reliability of assemblies using Pb-free alloys under' harsh e...
Actuellement, les alliages SAC sont largement utilisés en tant que matériaux de brasure. Les joints ...
The reliability of soldered connections is a very important issue in electronics industry. This proj...
De nos jours, une des stratégies pour améliorer les propriétés des brasures sans plomb est d'introdu...
This thesis aims to carry out theoretical and numerical developments on the thermo-mechanical cyclic...
The development of the component assemblies fabrication has been characterized during the last few y...
In Microelectronic and MEMS (Micro-Electro-Mechanical Systems) applications the volume of solder joi...
Le mémoire porte sur l’étude de la fiabilité des assemblages utilisant des alliages de brasure sans-...
Solder joints serve as both mechanical and electrical connections between elements in a package. The...
The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliabil...
A solid-state diffusion bonding technology, called thermodiffusion, has been developed to miniaturiz...
The new mechatronic technologies can significantly reduce the energy consumption and gas emissions o...
The new mechatronic technologies can significantly reduce the energy consumption and gas emissions o...
Les nouvelles technologies mécatroniques permettent de réduire fortement la consommation d'énergie e...
Nowadays, SAC alloys are widely used as soldering materials. The SAC solder joints have a dynamic mi...
The thesis focuses on the study of the reliability of assemblies using Pb-free alloys under' harsh e...
Actuellement, les alliages SAC sont largement utilisés en tant que matériaux de brasure. Les joints ...
The reliability of soldered connections is a very important issue in electronics industry. This proj...
De nos jours, une des stratégies pour améliorer les propriétés des brasures sans plomb est d'introdu...
This thesis aims to carry out theoretical and numerical developments on the thermo-mechanical cyclic...
The development of the component assemblies fabrication has been characterized during the last few y...
In Microelectronic and MEMS (Micro-Electro-Mechanical Systems) applications the volume of solder joi...
Le mémoire porte sur l’étude de la fiabilité des assemblages utilisant des alliages de brasure sans-...
Solder joints serve as both mechanical and electrical connections between elements in a package. The...
The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliabil...
A solid-state diffusion bonding technology, called thermodiffusion, has been developed to miniaturiz...