The increasing demand for multifunctional materials has become a recurrent challenge for a wide panel of application fields such as microelectronics and structural applications. Within the frame of this project, a multifunctional characterisation set-up has been developed at SIMaP lab, mainly based on the electrical / mechanical coupling. The heart of this device is an in situ FEG-SEM (Field Emission Gun Scanning Electron Microscope) nanoindenter coupled with an electrical measurement apparatus. This work has threefold objectives: (1) The investigation of mechanical behavior of small scale systems, (2) The input of electrical data to the quantitative analysis of mechanical behavior during indentation, in particular to obtain a better estima...
International audienceThe rising complexity of multi-material structures integrated into multi-funct...
International audienceThis paper reports the experimental, analytical, and numerical study of resist...
Afin de pouvoir continuer la miniaturisation de la brique de base des circuits électroniques, le tra...
The increasing demand for multifunctional materials has become a recurrent challenge for a wide pane...
L’essor de la demande actuelle pour des matériaux architecturés, en microélectronique par exemple, o...
International audienceFundamental understanding and quantitative characterization of electron transp...
The multi scale study of quasi static electrical contact is aimed at understanding those in MEMS mic...
Ohmic MEMS switches made by gold thin films are promising devices but their mechanical contacts are ...
AbstractA nanomechanical on-chip test platform has recently been developed to deform under a variety...
Dans cette thèse, le comportement nano-mécanique d’ilots d'Au sub-micrométriques est étudié par nano...
La connaissance du comportement et des propriétés des matériaux est d une grande importance pour opt...
Les films minces métalliques sont couramment utilisés en électronique, et les phénomènes plastiques ...
In nanoindentation, the occurrence of cracks, pileup, sink-in, or film delamination adds additional ...
The development of micro- and nano- technologies is strongly correlated with the knowledge of the me...
International audienceIn the past decades, efforts have been made to couple nanoindentation with res...
International audienceThe rising complexity of multi-material structures integrated into multi-funct...
International audienceThis paper reports the experimental, analytical, and numerical study of resist...
Afin de pouvoir continuer la miniaturisation de la brique de base des circuits électroniques, le tra...
The increasing demand for multifunctional materials has become a recurrent challenge for a wide pane...
L’essor de la demande actuelle pour des matériaux architecturés, en microélectronique par exemple, o...
International audienceFundamental understanding and quantitative characterization of electron transp...
The multi scale study of quasi static electrical contact is aimed at understanding those in MEMS mic...
Ohmic MEMS switches made by gold thin films are promising devices but their mechanical contacts are ...
AbstractA nanomechanical on-chip test platform has recently been developed to deform under a variety...
Dans cette thèse, le comportement nano-mécanique d’ilots d'Au sub-micrométriques est étudié par nano...
La connaissance du comportement et des propriétés des matériaux est d une grande importance pour opt...
Les films minces métalliques sont couramment utilisés en électronique, et les phénomènes plastiques ...
In nanoindentation, the occurrence of cracks, pileup, sink-in, or film delamination adds additional ...
The development of micro- and nano- technologies is strongly correlated with the knowledge of the me...
International audienceIn the past decades, efforts have been made to couple nanoindentation with res...
International audienceThe rising complexity of multi-material structures integrated into multi-funct...
International audienceThis paper reports the experimental, analytical, and numerical study of resist...
Afin de pouvoir continuer la miniaturisation de la brique de base des circuits électroniques, le tra...