This paper presents a systematic and comparative study of the composition and volume dependence of the cohesive properties for a large group of Me-X intermetallic phases (IPs) with Me=Cu,Ni and X=In,Sn, which are of interest in relation with the design of lead-free soldering (LFS) alloys. The work relies upon a database with total-energy versus volume information developed by using projected augmented waves (PAW) calculations. In previous papers by the current authors it was shown that these results account satisfactorily for the direct and indirect experimental data available. In the present work, the database is further expanded to investigate the composition dependence of the volume (V0), and the composition and volume dependence of the ...
[[abstract]]c2003 Springer - The Ni/Sn/Ni and Ni/Sn-0.7wt.%Cu/Ni couples are reacted at 200°C for va...
Cu-Sn phases are important intermetallic compounds formed at the interface between solder and substr...
The effect of nickel addition towards the intermetallic compound properties that formed between Sn-C...
This paper reports an analysis of the systematics of cohesive properties and equation-of-state param...
Motivated by the high solubility of In in (mC44) η′-Cu6Sn5 compound as well as the occurrence of an ...
A comprehensive study of the structural, cohesive and electronic properties of several stable, metas...
The present paper reports a comparative account of the structural, cohesive and thermodynamic stabil...
This work has its roots in a long-term theoretical research line aimed at developing a complete data...
The thermodynamic modeling of non-stoichiometric, multisublattice intermetallic phases using the Com...
Two computational approaches to the vibrational part of thermal properties and equation-of-state par...
The electronic structure, interatomic bonding, and mechanical properties of two supercell models of ...
Materials properties depend on phenomena in a hierarchical order from atomic to macroscopic scales. ...
The influence of alloying elements on the cohesive strength of metal heat-resistant alloys (HRAs) is...
Trough the following pages a comprehensive study of open structures will be shown, including mono-va...
[[abstract]]In general, formation and growth of intermetallic compounds (IMCs) play a major role in ...
[[abstract]]c2003 Springer - The Ni/Sn/Ni and Ni/Sn-0.7wt.%Cu/Ni couples are reacted at 200°C for va...
Cu-Sn phases are important intermetallic compounds formed at the interface between solder and substr...
The effect of nickel addition towards the intermetallic compound properties that formed between Sn-C...
This paper reports an analysis of the systematics of cohesive properties and equation-of-state param...
Motivated by the high solubility of In in (mC44) η′-Cu6Sn5 compound as well as the occurrence of an ...
A comprehensive study of the structural, cohesive and electronic properties of several stable, metas...
The present paper reports a comparative account of the structural, cohesive and thermodynamic stabil...
This work has its roots in a long-term theoretical research line aimed at developing a complete data...
The thermodynamic modeling of non-stoichiometric, multisublattice intermetallic phases using the Com...
Two computational approaches to the vibrational part of thermal properties and equation-of-state par...
The electronic structure, interatomic bonding, and mechanical properties of two supercell models of ...
Materials properties depend on phenomena in a hierarchical order from atomic to macroscopic scales. ...
The influence of alloying elements on the cohesive strength of metal heat-resistant alloys (HRAs) is...
Trough the following pages a comprehensive study of open structures will be shown, including mono-va...
[[abstract]]In general, formation and growth of intermetallic compounds (IMCs) play a major role in ...
[[abstract]]c2003 Springer - The Ni/Sn/Ni and Ni/Sn-0.7wt.%Cu/Ni couples are reacted at 200°C for va...
Cu-Sn phases are important intermetallic compounds formed at the interface between solder and substr...
The effect of nickel addition towards the intermetallic compound properties that formed between Sn-C...