Microstructural changes resulting from isothermal decomposition of the beta-phase have been studied in Cu-rich binary Cu-Al and ternary Cu-Al-Sn alloys containing up to 3 at.% Sn at temperatures from 873 to 673 K. Results are presented as TTT diagrams. The decomposition occurs in several stages, each of which involves the establishment of metastable equilibrium between beta and one or more of the product phases alpha, beta(1) and gamma(2). Addition of Sn has been shown to increase the stability of the ordered beta(1)-phase in relation to beta. In alloys containing more than 2 at.% Sn, the beta(1) emerges as a stable phase. At low Sn concentrations beta(1) is metastable. An important new finding is the existence of three-phase equilibrium mi...
The effect of a trace addition of Sn (0.01 at. pct) in Al-1.7Cu (at. pct) alloy in the preprecipitat...
[[abstract]]©2004 MRS - Phase equilibria of the Ag-Sn-Cu ternary system have been determined experim...
The intermetallic compound Cu Sn is a significant microstructural feature of many electronic devices...
Microstructural changes resulting from isothermal decomposition of the beta-phase have been studied ...
Phase equilibria in the Cu-rich corner of the ternary system Cu-Al-Sn have been re-investigated. Fin...
The ternary Cu-Al-Sn phase diagram is the base for several important types of alloys, with releva...
In the Cu-Al system, due to the sluggishness of the beta a dagger (alpha + gamma(1)) eutectoid react...
The isothermal decomposition products of hot worked beta and sigma copper tin alloys have been studi...
The completeness of beta-phase decomposition reaction in the Cu-11wt%Al-xwt%Ag alloys (x = 0, 1, 2, ...
AbstractIn this work, binary Sn-3.5%Ag and Sn-0.7%Cu and ternary Sn-3.5%Ag-0.9%Cu eutectic alloys ha...
The precipitation of the stable phases in Cu-Al-Ni shape memory alloys (SMA) limits the maximum usin...
The effect of a trace addition of Sn (0.01 at. pct) in Al-1.7Cu (at. pct) alloy in the preprecipitat...
The decomposition characteristics of tin bronzes have been examined by means of techniques adapted f...
Most lead-free solders comprise tin (Sn) as the majority component, and nominally pure β-Sn is the m...
It is shown that the alloy Cu-Zn-Al is a multiphase material. Under equilibrium conditions this allo...
The effect of a trace addition of Sn (0.01 at. pct) in Al-1.7Cu (at. pct) alloy in the preprecipitat...
[[abstract]]©2004 MRS - Phase equilibria of the Ag-Sn-Cu ternary system have been determined experim...
The intermetallic compound Cu Sn is a significant microstructural feature of many electronic devices...
Microstructural changes resulting from isothermal decomposition of the beta-phase have been studied ...
Phase equilibria in the Cu-rich corner of the ternary system Cu-Al-Sn have been re-investigated. Fin...
The ternary Cu-Al-Sn phase diagram is the base for several important types of alloys, with releva...
In the Cu-Al system, due to the sluggishness of the beta a dagger (alpha + gamma(1)) eutectoid react...
The isothermal decomposition products of hot worked beta and sigma copper tin alloys have been studi...
The completeness of beta-phase decomposition reaction in the Cu-11wt%Al-xwt%Ag alloys (x = 0, 1, 2, ...
AbstractIn this work, binary Sn-3.5%Ag and Sn-0.7%Cu and ternary Sn-3.5%Ag-0.9%Cu eutectic alloys ha...
The precipitation of the stable phases in Cu-Al-Ni shape memory alloys (SMA) limits the maximum usin...
The effect of a trace addition of Sn (0.01 at. pct) in Al-1.7Cu (at. pct) alloy in the preprecipitat...
The decomposition characteristics of tin bronzes have been examined by means of techniques adapted f...
Most lead-free solders comprise tin (Sn) as the majority component, and nominally pure β-Sn is the m...
It is shown that the alloy Cu-Zn-Al is a multiphase material. Under equilibrium conditions this allo...
The effect of a trace addition of Sn (0.01 at. pct) in Al-1.7Cu (at. pct) alloy in the preprecipitat...
[[abstract]]©2004 MRS - Phase equilibria of the Ag-Sn-Cu ternary system have been determined experim...
The intermetallic compound Cu Sn is a significant microstructural feature of many electronic devices...