Add to ORKGThe application of an algorithm shows that maximum uniformity of film thickness on a rotating substrate is achieved for a normalized source-to-substrate distance ratio, h/r =1.183
There are four parameters concerning the spin coating of a positive photoresist film. This paper foc...
Sputter deposition onto substrates with large or complex surfaces is difficult as sputtering is a “l...
The titanium thin films obtained by magnetron sputtering with the rotating substrate at different di...
The application of an algorithm shows that maximum uniformity of film thickness on a rotating substr...
A simple method for evaluating the geometrical parameters yielding maximum uniformity of film thickn...
Curves for the uniformity in film thickness on spherical substrates are drawn for various geometries...
For most applications of thin films, uniformity of film thickness over the substrate area is a neces...
For the purposes of obtaining a number of components with nearly identical thickness distributions o...
Normalized forms of conventional flux-distribution formulas are applied to physical-vapor deposition...
For most applications of thin films, uniformity of film thickness over the substrate area is a neces...
We report on a procedure of optimization of a thin-film deposition process with respect to the best ...
This talk focuses on the flow of a solidifying liquid film on a solid surface subject to a complex k...
The invention relates to a device and a method for producing layers with very good uniformity in coa...
AbstractMagnetron sputtering coating is widely applied in the large area deposition, and thin film t...
Spin coating is one of the dominant processes for producing photoresistant thin films in integrated ...
There are four parameters concerning the spin coating of a positive photoresist film. This paper foc...
Sputter deposition onto substrates with large or complex surfaces is difficult as sputtering is a “l...
The titanium thin films obtained by magnetron sputtering with the rotating substrate at different di...
The application of an algorithm shows that maximum uniformity of film thickness on a rotating substr...
A simple method for evaluating the geometrical parameters yielding maximum uniformity of film thickn...
Curves for the uniformity in film thickness on spherical substrates are drawn for various geometries...
For most applications of thin films, uniformity of film thickness over the substrate area is a neces...
For the purposes of obtaining a number of components with nearly identical thickness distributions o...
Normalized forms of conventional flux-distribution formulas are applied to physical-vapor deposition...
For most applications of thin films, uniformity of film thickness over the substrate area is a neces...
We report on a procedure of optimization of a thin-film deposition process with respect to the best ...
This talk focuses on the flow of a solidifying liquid film on a solid surface subject to a complex k...
The invention relates to a device and a method for producing layers with very good uniformity in coa...
AbstractMagnetron sputtering coating is widely applied in the large area deposition, and thin film t...
Spin coating is one of the dominant processes for producing photoresistant thin films in integrated ...
There are four parameters concerning the spin coating of a positive photoresist film. This paper foc...
Sputter deposition onto substrates with large or complex surfaces is difficult as sputtering is a “l...
The titanium thin films obtained by magnetron sputtering with the rotating substrate at different di...