Thin films of ceria, titania and zirconia have been prepared using ion assisted deposition (IAD). The energy of ions was varied between 0 and 1 keV and current densities up to 220 μA/cm2 were used. It was found that the stress behaviour is dependent on ion species, i.e. argon or oxygen, ion energy and current density and substrate temperature apart from the material. While ceria films showed tensile stresses under the influence of argon ion bombardment at ambient temperature, they showed a sharp transition from tensile to compressive stress with increase in substrate temperature. When bombarded with oxygen ions they showed a transition from tensile to compressive stress with increase in energy. The titania films deposited with oxygen ions, ...
Residual stress in thin films bends wafers used as substrates. The curved wafer may cause problems i...
The nature of the dependence of refractive index, extinction coefficient, and packing density of zir...
Zirconium dioxide thin films were deposited onto fused silica glass substrates by electron-beam assi...
Thin films of Ceria, Titania and Ziroonia have been prepared using Ion Assisted Deposition(IAD). The...
Ta_2O_5 and SiO_2 thin films, deposited at room temperature by ion-beam sputtering (IBS) and dual io...
AbstractTiO2 films were fabricated on Si substrate by using electron-beam gun evaporation. Influence...
Stress in thin films deposited by Reactive Low-Voltage Ion Plating (RLVIP) is studied in air and at ...
Understanding the stress behaviour in atomic layer deposited (ALD) thin films enables the optimizati...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
Stress in yttria stabilized zirconia (YSZ) thin films was controlled by using various substrates, wh...
Many properties of materials can be changed by varying the interatomic distances in the crystal latt...
Nanocrystalline ceria generally has significantly higher defect concentrations and more oxygen nonst...
The microstructure and residual stress of sputter-deposited yttria-stabilized zirconia (YSZ) films a...
This thesis covers the stress evolution in thin sputtered metal and oxide films. To achieve this, a ...
System on Chip (SoC) and System in Package (SiP) are two electronic technologies that involve integr...
Residual stress in thin films bends wafers used as substrates. The curved wafer may cause problems i...
The nature of the dependence of refractive index, extinction coefficient, and packing density of zir...
Zirconium dioxide thin films were deposited onto fused silica glass substrates by electron-beam assi...
Thin films of Ceria, Titania and Ziroonia have been prepared using Ion Assisted Deposition(IAD). The...
Ta_2O_5 and SiO_2 thin films, deposited at room temperature by ion-beam sputtering (IBS) and dual io...
AbstractTiO2 films were fabricated on Si substrate by using electron-beam gun evaporation. Influence...
Stress in thin films deposited by Reactive Low-Voltage Ion Plating (RLVIP) is studied in air and at ...
Understanding the stress behaviour in atomic layer deposited (ALD) thin films enables the optimizati...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
Stress in yttria stabilized zirconia (YSZ) thin films was controlled by using various substrates, wh...
Many properties of materials can be changed by varying the interatomic distances in the crystal latt...
Nanocrystalline ceria generally has significantly higher defect concentrations and more oxygen nonst...
The microstructure and residual stress of sputter-deposited yttria-stabilized zirconia (YSZ) films a...
This thesis covers the stress evolution in thin sputtered metal and oxide films. To achieve this, a ...
System on Chip (SoC) and System in Package (SiP) are two electronic technologies that involve integr...
Residual stress in thin films bends wafers used as substrates. The curved wafer may cause problems i...
The nature of the dependence of refractive index, extinction coefficient, and packing density of zir...
Zirconium dioxide thin films were deposited onto fused silica glass substrates by electron-beam assi...