$Al_{2}O_{3}/Al-AlN$ is a metal matrix composite (MMC) used for making heatsink of electronic devices. This paper presents the detailed investigations carried out on thermal contact resistance across this MMC contact in vacuum at different contact pressures. The experimental results are compared with the theoretical models available in the literature for metallic contacts and they are found to be in good agreement with each other
High thermal conductivity is one important factor in the selection or development of ceramics or com...
Heat sinks are commonly used for cooling electronic devices and high-power electrical systems. The e...
International audienceThe aim of this work is to obtain, without sintering, AlN compacts with a high...
Al12%Si10wt.%SiCp is a metal matrix composite (MMC) which is replacing the traditional metals in aut...
Abstract- In this work, effort has been made in the evaluation and enhancement of thermal transport ...
Aluminum nitride (AlN) has been applied to various applications, including electronic substrates and...
Aluminum nitride (AlN) particle reinforced metal-matrix-composites produced by pressure infiltration...
In power electronic systems, aluminum oxide (alumina) is frequently used to electrically isolate hig...
To explore whether pressure and temperature can affect thermal contact resistance, we have propos...
To explore whether pressure and temperature can affect thermal contact re-sistance, we have proposed...
Copper-based composites could be widely used in automotive, electronic or electrical industry due to...
Metal foams are considered beneficial for several applications because of its significantly large su...
Theoretical and experimental works on thermal rectification of similar anddissimilar materials, effe...
Thermal conductance of contacting surfaces is an important parameter for spacecraft thermal design. ...
The ongoing pursuit of improving the performance of microelectronics constantly increases the deman...
High thermal conductivity is one important factor in the selection or development of ceramics or com...
Heat sinks are commonly used for cooling electronic devices and high-power electrical systems. The e...
International audienceThe aim of this work is to obtain, without sintering, AlN compacts with a high...
Al12%Si10wt.%SiCp is a metal matrix composite (MMC) which is replacing the traditional metals in aut...
Abstract- In this work, effort has been made in the evaluation and enhancement of thermal transport ...
Aluminum nitride (AlN) has been applied to various applications, including electronic substrates and...
Aluminum nitride (AlN) particle reinforced metal-matrix-composites produced by pressure infiltration...
In power electronic systems, aluminum oxide (alumina) is frequently used to electrically isolate hig...
To explore whether pressure and temperature can affect thermal contact resistance, we have propos...
To explore whether pressure and temperature can affect thermal contact re-sistance, we have proposed...
Copper-based composites could be widely used in automotive, electronic or electrical industry due to...
Metal foams are considered beneficial for several applications because of its significantly large su...
Theoretical and experimental works on thermal rectification of similar anddissimilar materials, effe...
Thermal conductance of contacting surfaces is an important parameter for spacecraft thermal design. ...
The ongoing pursuit of improving the performance of microelectronics constantly increases the deman...
High thermal conductivity is one important factor in the selection or development of ceramics or com...
Heat sinks are commonly used for cooling electronic devices and high-power electrical systems. The e...
International audienceThe aim of this work is to obtain, without sintering, AlN compacts with a high...