We present for the first time the RF and linear performance of commercial 200 mm trap-rich HR-SOI wafers. These wafers are fully compatible with the thermal budget of CMOS process. The investigated SOI wafers with a fixed BOX of 400 nm-thick show effective resistivity values higher than 4 kΩ-cm and harmonic distortion levels lower than -81 dBm for a 900 MHz input signal with +15 dBm, i.e. more than 95 dBc. Our investigations confirm the capability of trap-rich HR-SOI wafer for the integration of RF systems in Si
The low resistivity substrate that is used in bulk silicon processes (CMOS and BiCMOS) limits the ...
This paper provides an overview of the issues associated with parasitic surface conduction (PSC) in ...
This last decade silicon-on-insulator (SOI) MOS-FET technology has demonstrated its potentialities f...
For the last five years the semiconductor industry has evolved from a quest to get more logic and co...
HR-SOI technology is currently addressing mobile challenges allowing heterogeneous integration on a ...
RF performance of a 200-mm commercial-enhanced signal integrity high resistivity silicon-on-insulato...
As CMOS technology continues to scale down, allowing operation in the GHz range, it provides the opp...
In this work, we investigate the impact of distinctly processed trap-rich layers of polysilicon inse...
In this work 3 different types of UNIBOND Silicon-on-Insulator 5SOI) wafers including one standard a...
During last decades, CMOS technology scaling down has enabled high frequency operation up to mm-W an...
This paper focuses on the comparison of the RF performances of various advanced trap-rich (TR) silic...
High Resistivity (HR) Si substrates with resistivity values higher than 3 kΩ.cm have been demonstrat...
The main objective of this paper is to evaluate RF losses and nonlinear behavior of coplanar wave- g...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
In this paper, we investigate the impact of a passivation layer on the performance of a commercial h...
The low resistivity substrate that is used in bulk silicon processes (CMOS and BiCMOS) limits the ...
This paper provides an overview of the issues associated with parasitic surface conduction (PSC) in ...
This last decade silicon-on-insulator (SOI) MOS-FET technology has demonstrated its potentialities f...
For the last five years the semiconductor industry has evolved from a quest to get more logic and co...
HR-SOI technology is currently addressing mobile challenges allowing heterogeneous integration on a ...
RF performance of a 200-mm commercial-enhanced signal integrity high resistivity silicon-on-insulato...
As CMOS technology continues to scale down, allowing operation in the GHz range, it provides the opp...
In this work, we investigate the impact of distinctly processed trap-rich layers of polysilicon inse...
In this work 3 different types of UNIBOND Silicon-on-Insulator 5SOI) wafers including one standard a...
During last decades, CMOS technology scaling down has enabled high frequency operation up to mm-W an...
This paper focuses on the comparison of the RF performances of various advanced trap-rich (TR) silic...
High Resistivity (HR) Si substrates with resistivity values higher than 3 kΩ.cm have been demonstrat...
The main objective of this paper is to evaluate RF losses and nonlinear behavior of coplanar wave- g...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
In this paper, we investigate the impact of a passivation layer on the performance of a commercial h...
The low resistivity substrate that is used in bulk silicon processes (CMOS and BiCMOS) limits the ...
This paper provides an overview of the issues associated with parasitic surface conduction (PSC) in ...
This last decade silicon-on-insulator (SOI) MOS-FET technology has demonstrated its potentialities f...