An AlGaN/GaN HEMT- and an InAlAs/InGaAs mHEMT technology, both with a gate-length of 100 nm, are investigated w.r.t. low-frequency dispersion and state dependency vs. average gate and drain voltages. Based on a comprehensive DC-CW and pulsed-RF small-signal characterization, it is shown that the GaN HEMT shows both effects, while the m HEMT is nearly free of state dependency. A new formulation of the recently proposed integral transform large-signal FET model is capable of describing both effects in pulsed-RF and even in CW load-pull operation conditions
The modeling of low-frequency dispersive effects due to surface state densities, deep level traps an...
International audienceInAlN/AlN/GaN high electron mobility transistors (HEMT) show interesting perfo...
In this paper a procedure to extract temperature dependent equivalent circuits for modeling the smal...
An AlGaN/GaN HEMT- and an InAlAs/InGaAs mHEMT technology, both with a gate-length of 100 nm, are inv...
A new concept for the low-frequency dispersion aspect of large-signal modeling of microwave III-V fi...
A recent approach for low-frequency dispersion modeling of III-V FET devices using combined integral...
The extraction of an accurate model for GaN HEMT devices is of fundamental importance for high-power...
The purpose of this study is to present an advanced technique for accurately modeling the behavior o...
A large-signal measurement setup with sinusoidal excitation is used for the characterization of low-...
International audienceFrequency dispersion of transconductance and output conductance in AlInN/GaN h...
This work presents an experimental study of the low-frequency dispersion which impairs the performan...
Low-frequency (LF) dispersive phenomena due to device self-heating and/or the presence of "traps" (i...
In this paper a recently proposed identification procedure based on exciting the device under test s...
Large-signal dynamic modelling of III-V FETs cannot be simply based on dc i/v characteristics, when ...
In this paper, we discuss the comparison of two GaN HEMT technology processes by means of large-sign...
The modeling of low-frequency dispersive effects due to surface state densities, deep level traps an...
International audienceInAlN/AlN/GaN high electron mobility transistors (HEMT) show interesting perfo...
In this paper a procedure to extract temperature dependent equivalent circuits for modeling the smal...
An AlGaN/GaN HEMT- and an InAlAs/InGaAs mHEMT technology, both with a gate-length of 100 nm, are inv...
A new concept for the low-frequency dispersion aspect of large-signal modeling of microwave III-V fi...
A recent approach for low-frequency dispersion modeling of III-V FET devices using combined integral...
The extraction of an accurate model for GaN HEMT devices is of fundamental importance for high-power...
The purpose of this study is to present an advanced technique for accurately modeling the behavior o...
A large-signal measurement setup with sinusoidal excitation is used for the characterization of low-...
International audienceFrequency dispersion of transconductance and output conductance in AlInN/GaN h...
This work presents an experimental study of the low-frequency dispersion which impairs the performan...
Low-frequency (LF) dispersive phenomena due to device self-heating and/or the presence of "traps" (i...
In this paper a recently proposed identification procedure based on exciting the device under test s...
Large-signal dynamic modelling of III-V FETs cannot be simply based on dc i/v characteristics, when ...
In this paper, we discuss the comparison of two GaN HEMT technology processes by means of large-sign...
The modeling of low-frequency dispersive effects due to surface state densities, deep level traps an...
International audienceInAlN/AlN/GaN high electron mobility transistors (HEMT) show interesting perfo...
In this paper a procedure to extract temperature dependent equivalent circuits for modeling the smal...