In extreme ultraviolet lithography (EUVL), insufficient light source power is the biggest concern for high-volume manufacturing. Additionally, the photon shot noise (PSN) effect is believed to be the main source of degradation in various aspects of imaging performance. In this study, we propose an attenuated phase-shift mask (PSM) as a solution to both of these issues, yielding improved mask performance for the printing of small contact hole (C/H) patterns. Our PSM shows superior imaging performance over that of a binary intensity mask. We speculate that the stochastic imaging characteristics are improved by the enhanced diffraction efficiency of the PSM.This work was supported by the Basic Science Research Program through the National Rese...
Abstract-The phase-shifting mask consists of a normal transmission mask that has been coated with a ...
With the slipping of the insertion node for extreme ultraviolet lithography, demands on resist resol...
With the slipplng of tbe insertion node for extreme ultraviolet lithography demands on resist resolu...
In extreme ultraviolet lithography, the photon shot noise effect is a main cause of low-quality imag...
Optimization of the absorber stack is becoming a critical issue in extreme ultraviolet (EUV) lithogr...
The understanding, characterization, and mitigation of three-dimensional (3-D) mask effects includin...
Sidewall angle (SWA) of an absorber stack in extreme ultraviolet lithography mask is considered to b...
As device continues to shrink beyond the theoretical limit of the optical exposure tools, other opti...
As device continues to shrink beyond the theoretical limit of the optical exposure tools, other opti...
Achieving high-throughput extreme ultraviolet (EUV) patterning remains a major challenge due to low ...
Achieving high-throughput extreme ultraviolet (EUV) patterning remains a major challenge due to low ...
Achieving high-throughput extreme ultraviolet (EUV) patterning remains a major challenge due to low ...
Sidewall angle (SWA) of an absorber stack in extreme ultraviolet lithography mask is considered to b...
In extreme ultraviolet lithography (EUVL), high numerical aperture (NA) optical system is considered...
The imaging performance of a half-tone phase shift mask (PSM) has been analyzed using coherent scatt...
Abstract-The phase-shifting mask consists of a normal transmission mask that has been coated with a ...
With the slipping of the insertion node for extreme ultraviolet lithography, demands on resist resol...
With the slipplng of tbe insertion node for extreme ultraviolet lithography demands on resist resolu...
In extreme ultraviolet lithography, the photon shot noise effect is a main cause of low-quality imag...
Optimization of the absorber stack is becoming a critical issue in extreme ultraviolet (EUV) lithogr...
The understanding, characterization, and mitigation of three-dimensional (3-D) mask effects includin...
Sidewall angle (SWA) of an absorber stack in extreme ultraviolet lithography mask is considered to b...
As device continues to shrink beyond the theoretical limit of the optical exposure tools, other opti...
As device continues to shrink beyond the theoretical limit of the optical exposure tools, other opti...
Achieving high-throughput extreme ultraviolet (EUV) patterning remains a major challenge due to low ...
Achieving high-throughput extreme ultraviolet (EUV) patterning remains a major challenge due to low ...
Achieving high-throughput extreme ultraviolet (EUV) patterning remains a major challenge due to low ...
Sidewall angle (SWA) of an absorber stack in extreme ultraviolet lithography mask is considered to b...
In extreme ultraviolet lithography (EUVL), high numerical aperture (NA) optical system is considered...
The imaging performance of a half-tone phase shift mask (PSM) has been analyzed using coherent scatt...
Abstract-The phase-shifting mask consists of a normal transmission mask that has been coated with a ...
With the slipping of the insertion node for extreme ultraviolet lithography, demands on resist resol...
With the slipplng of tbe insertion node for extreme ultraviolet lithography demands on resist resolu...