In this work, we introduce a facile method for fabricating well-aligned gold nanowires in a desired microstructure by combining the shear alignment of block copolymer (BCP) cylinders with a conventional lithography process. The aligned line patterns in a long-range order were firstly created with the shear alignment of cylinder-forming polystyrene-block-poly(2-vinylpyridine) thin films; then, gold was loaded to create metal nanowires. We directly employed photolithography on the nanopatterns, which simplified many fabrication steps. Furthermore, the combination of BCP assembly and photolithography allows for the independent control of nanopatterns and micropatterns, providing an opportunity to increase the nanopatterns' versatilit
'Directing' block copolymer (BCP) patterns is a possible option for future semiconductor device patt...
MasterBlock copolymers are composed of two or more polymer chain attached at their ends by covalent ...
To date silicon technology remains the predominant tool for semiconductor engineering and device fab...
The directed self-assembly of block copolymers (BCPs) is a promising route to generate highly ordere...
The objective of this project is to fabricate linear metallic patterns based on block copolymer lith...
ABSTRACT Metallic nanowires are useful for fabricating highly integrated nanoscale electrical, magne...
Micrometer-long gold nanowires were fabricated via self-assembly. Diblock copolymer films served as ...
The prolonged and aggressive nature of scaling to augment the performance of silicon integrated circ...
Nanoscale patterning in block copolymer (BCP) thin films is one of the key issues in nanoscience and...
Self-assembly of block copolymer in thin films provides an attractive approach to fabricating nanosc...
Highly aligned metal nanowire arrays with feature sizes approaching 10 nm are fabricated. This is ma...
While block copolymer lithography has been broadly applied as a bottom-up patterning technique, only...
While block copolymer lithography has been broadly applied as a bottom-up patterning technique, only...
We present a simple, versatile approach to generate highly ordered nanostructures of block copolymer...
While block copolymer lithography has been broadly applied as a bottom-up patterning technique, only...
'Directing' block copolymer (BCP) patterns is a possible option for future semiconductor device patt...
MasterBlock copolymers are composed of two or more polymer chain attached at their ends by covalent ...
To date silicon technology remains the predominant tool for semiconductor engineering and device fab...
The directed self-assembly of block copolymers (BCPs) is a promising route to generate highly ordere...
The objective of this project is to fabricate linear metallic patterns based on block copolymer lith...
ABSTRACT Metallic nanowires are useful for fabricating highly integrated nanoscale electrical, magne...
Micrometer-long gold nanowires were fabricated via self-assembly. Diblock copolymer films served as ...
The prolonged and aggressive nature of scaling to augment the performance of silicon integrated circ...
Nanoscale patterning in block copolymer (BCP) thin films is one of the key issues in nanoscience and...
Self-assembly of block copolymer in thin films provides an attractive approach to fabricating nanosc...
Highly aligned metal nanowire arrays with feature sizes approaching 10 nm are fabricated. This is ma...
While block copolymer lithography has been broadly applied as a bottom-up patterning technique, only...
While block copolymer lithography has been broadly applied as a bottom-up patterning technique, only...
We present a simple, versatile approach to generate highly ordered nanostructures of block copolymer...
While block copolymer lithography has been broadly applied as a bottom-up patterning technique, only...
'Directing' block copolymer (BCP) patterns is a possible option for future semiconductor device patt...
MasterBlock copolymers are composed of two or more polymer chain attached at their ends by covalent ...
To date silicon technology remains the predominant tool for semiconductor engineering and device fab...