Nowadays people have a fancy for good electrically and thermally conductivity adhesives because they have wide applications compared with the ordinary adhesives, especially in the field of electronic packaging. However, the cost is subject to high volume content of the metal fillers, which can't be reduced effectively. This review summarizes the latest research work and analyzes the reported methods aimed to solve this kind of problem in recent years. Nanocarbon materials, such as carbon nanotubes (CNTs) and graphene, have excellent electrical, mechanical and thermal properties, which have been widely used as fillers in the composites. By mixing them with metal fillers, it is able to reduce 10 wt% similar to 20 wt% content of metal fillers....
CNTs have excellent thermal, electrical and mechanical properties. They can be used in various ways....
Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, be...
Lead-tin solder has been widely used as interconnection material in electronics packaging for a long...
Electronics packaging must be designed to meet the increasing requirements of the microelectronics i...
Flexible conductive adhesive could be used in flexible device electronic packaging. In this study, c...
This paper describes the investigations of different functionalised and non functionalised types of ...
In this study, a simple solution-mixing method is used to develop a kind of excellent flexible, elec...
In this paper, a novel isotropic conductive adhesive containing different fillers, which shows bette...
The fast growing development of the microelectronic industry permanently pushes the development and ...
Isotropic conductive adhesives (ICAs) with stable contact resistance and high thermal conductivity a...
Electrically conductive adhesives (ECA) are an alternative to tin/lead solders for attaching Surface...
Adhesives are increasingly being employed as alternatives to mechanical fasteners in aerospace and o...
Carbon nanotubes filled epoxy resin is one type of electrically conductive adhesives (ECAs) that is...
This paper describes the influence of carbon nanotubes onto electrical properties of electrically co...
The part of electronics packaging is steadily forced to adapt the requirements of the microelectroni...
CNTs have excellent thermal, electrical and mechanical properties. They can be used in various ways....
Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, be...
Lead-tin solder has been widely used as interconnection material in electronics packaging for a long...
Electronics packaging must be designed to meet the increasing requirements of the microelectronics i...
Flexible conductive adhesive could be used in flexible device electronic packaging. In this study, c...
This paper describes the investigations of different functionalised and non functionalised types of ...
In this study, a simple solution-mixing method is used to develop a kind of excellent flexible, elec...
In this paper, a novel isotropic conductive adhesive containing different fillers, which shows bette...
The fast growing development of the microelectronic industry permanently pushes the development and ...
Isotropic conductive adhesives (ICAs) with stable contact resistance and high thermal conductivity a...
Electrically conductive adhesives (ECA) are an alternative to tin/lead solders for attaching Surface...
Adhesives are increasingly being employed as alternatives to mechanical fasteners in aerospace and o...
Carbon nanotubes filled epoxy resin is one type of electrically conductive adhesives (ECAs) that is...
This paper describes the influence of carbon nanotubes onto electrical properties of electrically co...
The part of electronics packaging is steadily forced to adapt the requirements of the microelectroni...
CNTs have excellent thermal, electrical and mechanical properties. They can be used in various ways....
Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, be...
Lead-tin solder has been widely used as interconnection material in electronics packaging for a long...