Functionalized carbon nanotubes (CNTs) were introduced into silicone grease to accompany the subsistent metallic oxide particles (micron-sized Al2O3, submicron-sized ZnO) with the aim of enhancing the thermal contact conductance of the composite grease as thermal interface materials (TIMs). The well-dispersed CNTs located among the metallic oxide particles to construct a three dimensional network structure and cooperated with them to form a highly efficient thermal transferring path. The functionalization of CNTs played a key role in achieving a good dispersion of CNTs in silicone grease matrix. The carboxylated CNTs were observed to show better dispersion in silicone grease and weaker reaction with oxide particles than pristine CNTs ...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
The power density of electronic packages has substantially increased. The thermal interface resistan...
Effective application of thermal interface materials (TIM) sandwiched between silicon and a heat spr...
Thanks to the IT technologies, our living−standard has improved greatly. Electronic devices thus bec...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
The friction at high speed and high pressure tends to cause the lowering of grease stickiness becaus...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
To allow electronic devices to operate within allowable temperatures, heat sinks and fans are employ...
The effect of multiwall carbon nanotubes (MWCNTs) and magnesium oxide (MgO) on the thermal conductiv...
The use of 0.6 vol. % single-walled carbon nanotubes in a poly(ethylene glycol)-based dispersion gav...
The thermal interface layer can be a limiting element in the cooling of microelectronic devices. Con...
Carbon nanotubes (CNTs) possess excellent electrical, thermal and mechanical properties. They are li...
Electrical and thermal management in nanodevices by means of carbon nanotube is highly promising. On...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
The power density of electronic packages has substantially increased. The thermal interface resistan...
Effective application of thermal interface materials (TIM) sandwiched between silicon and a heat spr...
Thanks to the IT technologies, our living−standard has improved greatly. Electronic devices thus bec...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
The friction at high speed and high pressure tends to cause the lowering of grease stickiness becaus...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
To allow electronic devices to operate within allowable temperatures, heat sinks and fans are employ...
The effect of multiwall carbon nanotubes (MWCNTs) and magnesium oxide (MgO) on the thermal conductiv...
The use of 0.6 vol. % single-walled carbon nanotubes in a poly(ethylene glycol)-based dispersion gav...
The thermal interface layer can be a limiting element in the cooling of microelectronic devices. Con...
Carbon nanotubes (CNTs) possess excellent electrical, thermal and mechanical properties. They are li...
Electrical and thermal management in nanodevices by means of carbon nanotube is highly promising. On...
The under-hood automotive ambient is harsh and its impact on electronics used in electronic control ...
The power density of electronic packages has substantially increased. The thermal interface resistan...
Effective application of thermal interface materials (TIM) sandwiched between silicon and a heat spr...