Solder Joint Strength Measuring

This thesis studies the definition of solder joint strength and its contributing factors. It also evaluates the options provided by using a MARK10 M5-100 digital force gauge with MESURgauge software for measuring solder joint strength and practically tests solder joint strength of SMD components sized 1206, 0805 and leads of THT components. Based on this, the thesis suggests further tests to be done in order to evaluates the degree to which each factor affects solder joint strength and suggests possible improvements of testing procedures used. These tests and improvements will be explored by a follow-up thesis, which will also be creating a part of a guide to a new laboratory exercise