Variable-range-hopping through dislocations was identified as the main off-state leakage mechanism for GaN vertical diodes on different substrates. The behavior of leakage current for vertical devices as a function of dislocation density and electric field was derived by TCAD simulations, after careful calibration with experiments and literature data. Designed GaN vertical diodes demonstrate 2-4 orders of magnitude lower leakage current while supporting 3-5 times higher electric field, compared to GaN lateral, Si and SiC devices.United States. Advanced Research Projects Agency-EnergyMIT Energy Initiativ
Substrate ramps and stepped stress transient measurements are applied to study vertical charge trans...
We present an investigation of vertical leakage in GaN-on-Si epitaxial stack through electrical char...
The influence of structural defects in the active layer of GaN-on-Si substrates on the vertical leak...
Conventional GaN vertical devices, though promising for high-power applications, need expensive GaN ...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Comp...
In recent years, GaN power semiconductor devices have been the focus of research and development due...
This work studies the leakage and breakdown mechanisms of 1.2 kV GaN vertical power FinFETs with edg...
Reverse bias leakage in bulk GaN-on-GaN pn diodes has been studied as a function of time. A peak was...
This work investigates p(+)n(-)n GaN-on-Si vertical structures, through dedicated measurements and T...
This work investigates p+n-n GaN-on-Si vertical structures, through dedicated measurements and TCAD ...
A 2D TCAD-based approach is proposed to investigate the leakage current and breakdown regime of GaN/...
We investigate the vertical leakage mechanism in metal-organic chemical vapor deposition-grown carbo...
This work investigates p+ n− n GaN-on-Si vertical structures, through dedicated measure-ments and TC...
A TCAD-based approach has been used to investigate the leakage current and breakdown regime of verti...
This paper studies the key parameters affecting on-resistance and current crowding in quasi-vertical...
Substrate ramps and stepped stress transient measurements are applied to study vertical charge trans...
We present an investigation of vertical leakage in GaN-on-Si epitaxial stack through electrical char...
The influence of structural defects in the active layer of GaN-on-Si substrates on the vertical leak...
Conventional GaN vertical devices, though promising for high-power applications, need expensive GaN ...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Comp...
In recent years, GaN power semiconductor devices have been the focus of research and development due...
This work studies the leakage and breakdown mechanisms of 1.2 kV GaN vertical power FinFETs with edg...
Reverse bias leakage in bulk GaN-on-GaN pn diodes has been studied as a function of time. A peak was...
This work investigates p(+)n(-)n GaN-on-Si vertical structures, through dedicated measurements and T...
This work investigates p+n-n GaN-on-Si vertical structures, through dedicated measurements and TCAD ...
A 2D TCAD-based approach is proposed to investigate the leakage current and breakdown regime of GaN/...
We investigate the vertical leakage mechanism in metal-organic chemical vapor deposition-grown carbo...
This work investigates p+ n− n GaN-on-Si vertical structures, through dedicated measure-ments and TC...
A TCAD-based approach has been used to investigate the leakage current and breakdown regime of verti...
This paper studies the key parameters affecting on-resistance and current crowding in quasi-vertical...
Substrate ramps and stepped stress transient measurements are applied to study vertical charge trans...
We present an investigation of vertical leakage in GaN-on-Si epitaxial stack through electrical char...
The influence of structural defects in the active layer of GaN-on-Si substrates on the vertical leak...