This paper describes an original methodology for the modeling of parasitic inductive couplings. The key idea is the use of magnetic hooks which are gates for magnetic fluxes that cross conductive loops and consequently induce parasitic voltages, thus disturbing the signal integrity. The multiple connected domains of integrated circuits are modeled by a Magneto-Electric-Equivalent-Circuit (MEEC), consisting of two mutual coupled circuits, an electric and magnetic one. Magnetic hooks are the externally connected nodes of the magnetic circuit. © 2014 The Institute of Electronics, Information and Communication Engineer. Keywords: Chip; Computational Electromagnetics; IC & Semiconductor EMC; Numerical Modeling; Signal Integrit
Abstract. Inductive powering can free microelectromechanical systems (MEMS) devices from tethering t...
Purpose: The paper seeks to develop dual 3D finite element (FE) formulations for modeling both induc...
Purpose - The paper seeks to develop dual 3D finite element (FE) formulations for modeling both indu...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compo...
Higher integration and smaller layout size, two major trends in today's industry, lead to more promi...
This paper proposes a new method to indirectly consider the magnetic material of rod core coils for ...
A novel circuit topology for inductive coupling between intercon-necting wires is presented. The mod...
Abstract:- The development of integrated circuits has reached a situation today that the circuit ope...
Broadband circuit models for electric machines are effective means to understand, predict, and contr...
Abstract:- The electromagnetic compatibility (EMC) is one of the most important reliability paramete...
Abstract. Inductive powering can free microelectromechanical systems (MEMS) devices from tethering t...
Purpose: The paper seeks to develop dual 3D finite element (FE) formulations for modeling both induc...
Purpose - The paper seeks to develop dual 3D finite element (FE) formulations for modeling both indu...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compon...
Abstract: Purpose – The main aim of this study is the modelling of the interaction of on-chip compo...
Higher integration and smaller layout size, two major trends in today's industry, lead to more promi...
This paper proposes a new method to indirectly consider the magnetic material of rod core coils for ...
A novel circuit topology for inductive coupling between intercon-necting wires is presented. The mod...
Abstract:- The development of integrated circuits has reached a situation today that the circuit ope...
Broadband circuit models for electric machines are effective means to understand, predict, and contr...
Abstract:- The electromagnetic compatibility (EMC) is one of the most important reliability paramete...
Abstract. Inductive powering can free microelectromechanical systems (MEMS) devices from tethering t...
Purpose: The paper seeks to develop dual 3D finite element (FE) formulations for modeling both induc...
Purpose - The paper seeks to develop dual 3D finite element (FE) formulations for modeling both indu...