A novel 3D stacking method for opto-electronic dies on CMOS ICs
- Duan, P.
- Raz, O.
- Smalbrugge, B.E.
- Duis, J.
- Dorren, H.J.S.
DOIAbstract
High speed, high density and low cost solution for realizing optical interconnects is presented. An opto-electronic die, directly bonded on top of CMOS IC driver, is connected using metal traces lithographically defined. A twelve channel transmitter based on the technique was fabricated, and test shows good performance up to 12.5 Gb/s/ch
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