This paper describes three Ph.D. projects performed in the framework of the Tangram project [1], in which the Systems Engineering group (Dept. of Mechanical Engineering) from the Eindhoven University of Technology is involved. The Tangram project is a close cooperation between the Embedded Systems Institute (ESI) [2], ASML [3] and several academic partners. The project aims at a reduction of cost and lead time in the integration and test phases of complex high-tech products, such as ASML wafer scanners. Specifically, the aim is to reduce both the time to shipment and the test time at the customer’s site. The primary project objective is to define a test methodology with supporting processes and tools providing a right balance between produc...
Industrial trends show that the lead time and costs of integrating and testing high-tech multi-disci...
This paper describes a method to determine the optimal integration and test plan for embedded system...
The integration and test phase of complex manufacturing machines, like an ASML lithographic manufact...
This paper describes three Ph.D. projects performed in the framework of the Tangram project [1], in ...
The integration and test phase of a new type of a complex system, like an ASML waferscanner, takes u...
Integration and test planning of embedded systems is a task often performed by industry experts. The...
New methods and techniques are needed to reduce the very costly integration and test effort (in term...
AbstractNew methods and techniques are needed to reduce the very costly integration and test effort ...
The integration and test phases that are part of the development and manufacturing of complex manufa...
To reduce the integration and test effort for high-tech multi-disciplinary systems, we are developin...
The effort required for integration and testing of high-tech multi-disciplinary systems is increasin...
For manufacturers of high-tech multi-disciplinary systems such as semiconductor equipment, the effor...
Industrial trends show that the lead time and costs of integrating and testing high-tech multi-disci...
This paper describes a method to determine the optimal integration and test plan for embedded system...
The integration and test phase of complex manufacturing machines, like an ASML lithographic manufact...
This paper describes three Ph.D. projects performed in the framework of the Tangram project [1], in ...
The integration and test phase of a new type of a complex system, like an ASML waferscanner, takes u...
Integration and test planning of embedded systems is a task often performed by industry experts. The...
New methods and techniques are needed to reduce the very costly integration and test effort (in term...
AbstractNew methods and techniques are needed to reduce the very costly integration and test effort ...
The integration and test phases that are part of the development and manufacturing of complex manufa...
To reduce the integration and test effort for high-tech multi-disciplinary systems, we are developin...
The effort required for integration and testing of high-tech multi-disciplinary systems is increasin...
For manufacturers of high-tech multi-disciplinary systems such as semiconductor equipment, the effor...
Industrial trends show that the lead time and costs of integrating and testing high-tech multi-disci...
This paper describes a method to determine the optimal integration and test plan for embedded system...
The integration and test phase of complex manufacturing machines, like an ASML lithographic manufact...