A new approach for efficient estimation of die-level process parameter variations based on the expectation- maximization algorithm is proposed. To estimate the parameters and enhance diagnostic analysis, dedicated embedded sensors have been designed. Additionally, to guide the test with the information obtained through monitoring process variations, maximum-likelihood method and adjusted support vector machine classifier is employed. The information acquired is re-used and supplement the circuit calibration. The proposed estimation method is evaluated on a prototype ADC converter with dedicated sensors fabricated in standard single poly, five metal 0.09-mum CMOS
Nowadays the highest device integration affects the design process in several ways. The process vari...
This thesis presents a statistical method to identify the test escapes. Test often acquires parametr...
Semiconductor technology has been scaling down at an exponential rate for many decades, yielding dra...
A new approach for efficient estimation of die-level process parameter variations based on the expec...
This paper reports design, efficiency, and measurement results of the process variation and temperat...
A method for diagnosing process parameter variations from measurements in analog circuits. The diagn...
Integrated Circuit (IC) designers have always faced the problem of small deviations in parameters of...
Abstract — A novel digital technique for efficient calibration of static errors in high-speed, high-...
This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-...
Abstract—In this paper we propose a novel statistical frame-work to model the impact of process vari...
Abstract — Within-die process variations arise during inte-grated circuit (IC) fabrication in the su...
A novel digital technique for efficient calibration of static errors in high-speed, high-resolution,...
This paper presents a simple yet effective method to analyze process variations using statistics on ...
A practical approach of extracting MOS device BSIM3 model parameters to represent process variations...
Manufacturing lines are formed by several unit process steps whose individual purposes are to bring ...
Nowadays the highest device integration affects the design process in several ways. The process vari...
This thesis presents a statistical method to identify the test escapes. Test often acquires parametr...
Semiconductor technology has been scaling down at an exponential rate for many decades, yielding dra...
A new approach for efficient estimation of die-level process parameter variations based on the expec...
This paper reports design, efficiency, and measurement results of the process variation and temperat...
A method for diagnosing process parameter variations from measurements in analog circuits. The diagn...
Integrated Circuit (IC) designers have always faced the problem of small deviations in parameters of...
Abstract — A novel digital technique for efficient calibration of static errors in high-speed, high-...
This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-...
Abstract—In this paper we propose a novel statistical frame-work to model the impact of process vari...
Abstract — Within-die process variations arise during inte-grated circuit (IC) fabrication in the su...
A novel digital technique for efficient calibration of static errors in high-speed, high-resolution,...
This paper presents a simple yet effective method to analyze process variations using statistics on ...
A practical approach of extracting MOS device BSIM3 model parameters to represent process variations...
Manufacturing lines are formed by several unit process steps whose individual purposes are to bring ...
Nowadays the highest device integration affects the design process in several ways. The process vari...
This thesis presents a statistical method to identify the test escapes. Test often acquires parametr...
Semiconductor technology has been scaling down at an exponential rate for many decades, yielding dra...