Moisture diffusion model verification of packaging materials
- Ma, X.S.
- Jansen, K.M.B.
- Ernst, L.J.
- Driel, van, W.D.
- Sluis, van der, O.
- Zhang, G.Q.
- Regard, C.
- Gautier, C.
- Fremont, H.
- Bi, K.
Publication date
January 2008
DOI Publisher
Institute of Electrical and Electronics Engineers (IEEE)Abstract
The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier
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