Power cycle reliability of solder joints with Sn-5Sb (mass%) and Sn-10Sb (mass%) alloys was investigated. The effects of power cycling and heat aging on the growth of intermetallic compound (IMC) layers at the interfaces between Sn-Sb alloys and Cu plates were also investigated. In the power cycling test, the solder joint with Sn-10Sb has high reliability compared with that of Sn-5Sb. IMC layers grew in both joints with increasing number of power cycles. Compared with Sn-5Sb and Sn-10Sb, difference in growth kinetics of IMC layers was negligible. A similar tendency was observed in the heat aging test. Compared with the power cycling and the heat aging, growth of IMC layers at the aging temperature of 200°C is faster than that in the power c...
Solder joints play an important role in electronics packaging, serving both as electrical interconne...
Currently, electronic products have shrunk into smaller size and in order to increase the input/outp...
This article will present the influence of thermal aging and the reflow cycle numbers on intermetall...
The growth of interfacial intermetallic compounds (IMC) between Pb-free and Pb-based solders with di...
The introduction of alternative, non-lead bearing solders into electronic assemblies requires a thor...
This article will present the influence of thermal aging and the reflow cycle numbers on intermetall...
The effect of current stressing on the reliability of 63Sn37Pb solder joints with Cu pads was invest...
In electronic packaging, the reliability of the interconnection changes with the surface finish and ...
Intermetallic compounds (IMCs) play a great role in solder joint reliability. Intermetallic formatio...
Intermetallic compounds (IMCs) play a great role in solder joint reliability. Intermetallic formatio...
Solder joints on printed circuit boards provide electrical and mechanical connections between electr...
Intermetallic compound (IMC) formations of Sn–2.8Ag–0.5Cu solder with additional 1 wt% Bi were studi...
In electronic packaging, the reliability of the interconnection changes with the surface finish and ...
The growth kinetics of an intermetallic compound (IMC) layer formed between Sn-3.5Ag-0.5Cu (SAC) sol...
This work investigates the effect of interfacial reaction on the mechanical strength of two types of...
Solder joints play an important role in electronics packaging, serving both as electrical interconne...
Currently, electronic products have shrunk into smaller size and in order to increase the input/outp...
This article will present the influence of thermal aging and the reflow cycle numbers on intermetall...
The growth of interfacial intermetallic compounds (IMC) between Pb-free and Pb-based solders with di...
The introduction of alternative, non-lead bearing solders into electronic assemblies requires a thor...
This article will present the influence of thermal aging and the reflow cycle numbers on intermetall...
The effect of current stressing on the reliability of 63Sn37Pb solder joints with Cu pads was invest...
In electronic packaging, the reliability of the interconnection changes with the surface finish and ...
Intermetallic compounds (IMCs) play a great role in solder joint reliability. Intermetallic formatio...
Intermetallic compounds (IMCs) play a great role in solder joint reliability. Intermetallic formatio...
Solder joints on printed circuit boards provide electrical and mechanical connections between electr...
Intermetallic compound (IMC) formations of Sn–2.8Ag–0.5Cu solder with additional 1 wt% Bi were studi...
In electronic packaging, the reliability of the interconnection changes with the surface finish and ...
The growth kinetics of an intermetallic compound (IMC) layer formed between Sn-3.5Ag-0.5Cu (SAC) sol...
This work investigates the effect of interfacial reaction on the mechanical strength of two types of...
Solder joints play an important role in electronics packaging, serving both as electrical interconne...
Currently, electronic products have shrunk into smaller size and in order to increase the input/outp...
This article will present the influence of thermal aging and the reflow cycle numbers on intermetall...