In this work, an uncalibrated TCAD methodology for simulation of electrostatic discharge (ESD) devices is presented. The methodology addresses TCAD setup issues including device construction, boundary conditions, and choosing a physical model and parameters. A major trade-off between computation complexity and accuracy, 2D vs. 3D simulations, is examined in detail. TCAD simulation results for the GGNMOS in 32 nm CMOS technology is compared with published measurement results for methodology validation. The established TCAD methodology is then applied to ESD protection silicon controlled rectifier (SCR) devices to identify physical causes for high overshoot of a certain SCR layout, and to verify proposed improvements. The performance of the S...
This thesis presents the derivation and validation processes of analytical models describing the dyn...
investigation of the thermalization performance of superconducting absorbers and in fabrication of G...
Multilayer embedded passives (resistors, inductors, and capacitors) on a printed wiring board can he...
Advances in integrated circuit design and packaging techniques have introduced new ESD-susceptible (...
Hardware and application-level manifestations of ESD soft failures were characterized for three sing...
Small satellites such as CubeSats operate under environmental constraints that are outside of typica...
The aggressive scaling imposed by CMOS technology has put very stringent requirements on the dimensi...
For several decades, technology scaling has brought many orders of magnitude improvements in digital...
Due to Globalization outsourcing of SoC designs either for verification, testing and fabrication has...
Duo to technology downscaling, embedded systems have increased in complexity and heterogeneity. Incr...
A detailed computer model of a three-phase power network which includes inductive loads, resistance ...
The objective of this research project is to be able to understand the role of various microstructur...
abstract: Concurrency bugs are one of the most notorious software bugs and are very difficult to man...
Currently, three-terminal devices with N-shaped I-V characteristics are being fabricated for switchi...
Supercapacitors are becoming very important in the automotive and energy and power industry due to t...
This thesis presents the derivation and validation processes of analytical models describing the dyn...
investigation of the thermalization performance of superconducting absorbers and in fabrication of G...
Multilayer embedded passives (resistors, inductors, and capacitors) on a printed wiring board can he...
Advances in integrated circuit design and packaging techniques have introduced new ESD-susceptible (...
Hardware and application-level manifestations of ESD soft failures were characterized for three sing...
Small satellites such as CubeSats operate under environmental constraints that are outside of typica...
The aggressive scaling imposed by CMOS technology has put very stringent requirements on the dimensi...
For several decades, technology scaling has brought many orders of magnitude improvements in digital...
Due to Globalization outsourcing of SoC designs either for verification, testing and fabrication has...
Duo to technology downscaling, embedded systems have increased in complexity and heterogeneity. Incr...
A detailed computer model of a three-phase power network which includes inductive loads, resistance ...
The objective of this research project is to be able to understand the role of various microstructur...
abstract: Concurrency bugs are one of the most notorious software bugs and are very difficult to man...
Currently, three-terminal devices with N-shaped I-V characteristics are being fabricated for switchi...
Supercapacitors are becoming very important in the automotive and energy and power industry due to t...
This thesis presents the derivation and validation processes of analytical models describing the dyn...
investigation of the thermalization performance of superconducting absorbers and in fabrication of G...
Multilayer embedded passives (resistors, inductors, and capacitors) on a printed wiring board can he...