125 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2000.The methodologies and techniques developed in this research are implemented in a fast interconnect/timing simulator, ILLIADS-I. In their practical implementation the robustness of the interconnect models is further improved to achieve absolute numerical stability in addition to their theoretical passivity and stability. Unlike other approaches, the interconnect simulation methods in ILLIADS-I do not handle the interconnect network separately for obtaining and then placing a corresponding stamp into a SPICE-like simulator. The accuracy and speed have been demonstrated for a number of circuits for various loads and input waveforms. Experimental results show that ILLIADS-I ...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
With the increase in the density of interconnects and the complexity of high-speed packages, signal ...
When considering all the steps from packaging to verification of the design one is faced with many c...
The basic goals of the research presented in this thesis are to remove various shortcomings in exist...
The basic goals of the research presented in this thesis are to remove various shortcomings in exist...
This thesis addresses modeling and simulation of high speed interconnects. Both a full transmission ...
This thesis addresses modeling and simulation of high speed interconnects. Both a full transmission ...
This paper presents a two-step, RC-interconnect in-sensitive linear time-varying (LTV) driver model ...
As operating frequency increases and device sizes shrink, the complexity of current state-of-the-art...
Abstract—A typical integrated-circuit model consists of nonlinear transistor models and large linear...
195 p.Timing analysis of high-order networks has been an important issue in system study. The delay ...
195 p.Timing analysis of high-order networks has been an important issue in system study. The delay ...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
With the increase in the density of interconnects and the complexity of high-speed packages, signal ...
When considering all the steps from packaging to verification of the design one is faced with many c...
The basic goals of the research presented in this thesis are to remove various shortcomings in exist...
The basic goals of the research presented in this thesis are to remove various shortcomings in exist...
This thesis addresses modeling and simulation of high speed interconnects. Both a full transmission ...
This thesis addresses modeling and simulation of high speed interconnects. Both a full transmission ...
This paper presents a two-step, RC-interconnect in-sensitive linear time-varying (LTV) driver model ...
As operating frequency increases and device sizes shrink, the complexity of current state-of-the-art...
Abstract—A typical integrated-circuit model consists of nonlinear transistor models and large linear...
195 p.Timing analysis of high-order networks has been an important issue in system study. The delay ...
195 p.Timing analysis of high-order networks has been an important issue in system study. The delay ...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
A new technique is described for modelling a general distributed RC line through a simple lumped net...
With the increase in the density of interconnects and the complexity of high-speed packages, signal ...