A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper surface of the interposer around the chip. First metal lines run on the upper surface of the interposer and are arranged between conductive elements of connection to the chip. An end of each first metal line is arranged to extend beyond a projection of the chip on the interposer. A thermally-conductive via connects the end of the first metal line to a heat sink supported at an upper surface of the device
The integration of bridge connection line on an electronic integrated circuit (IC) package construct...
The various embodiments of the present invention provide a novel chip-last embedded structure, where...
L’intégration hétérogène de circuits électroniques sur un interposeur silicium offre de nouvelles pe...
A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper...
The chip comprises a network of trench capacitors and an inductor, wherein the trench capacitors are...
DE 20021698 U UPAB: 20010628 NOVELTY - The integrated circuit includes a chip (1) without casing, an...
The miniaturization of integrated circuit (IC) becomes the common direction for semiconductor electr...
The present disclosure relates to a chip including a wafer, a back-end-of-line (BEOL) layer deposite...
The present disclosure relates to a chip including a wafer, a back-end-of-line (BEOL) layer deposite...
Silicon interposers enable the heterogeneous integration of high performance systems. This paper foc...
Forming an interconnect of a semiconductor device includes defining a recessed structure proximate t...
Forming an interconnect of a semiconductor device includes defining a recessed structure proximate t...
Forming an interconnect of a semiconductor device includes defining a recessed structure proximate t...
A 3D interconnect structure comprising an ultra-thin interposer having a plurality of ultra-high den...
Silicon interposers enable the heterogeneous integration of high performance systems. This paper foc...
The integration of bridge connection line on an electronic integrated circuit (IC) package construct...
The various embodiments of the present invention provide a novel chip-last embedded structure, where...
L’intégration hétérogène de circuits électroniques sur un interposeur silicium offre de nouvelles pe...
A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper...
The chip comprises a network of trench capacitors and an inductor, wherein the trench capacitors are...
DE 20021698 U UPAB: 20010628 NOVELTY - The integrated circuit includes a chip (1) without casing, an...
The miniaturization of integrated circuit (IC) becomes the common direction for semiconductor electr...
The present disclosure relates to a chip including a wafer, a back-end-of-line (BEOL) layer deposite...
The present disclosure relates to a chip including a wafer, a back-end-of-line (BEOL) layer deposite...
Silicon interposers enable the heterogeneous integration of high performance systems. This paper foc...
Forming an interconnect of a semiconductor device includes defining a recessed structure proximate t...
Forming an interconnect of a semiconductor device includes defining a recessed structure proximate t...
Forming an interconnect of a semiconductor device includes defining a recessed structure proximate t...
A 3D interconnect structure comprising an ultra-thin interposer having a plurality of ultra-high den...
Silicon interposers enable the heterogeneous integration of high performance systems. This paper foc...
The integration of bridge connection line on an electronic integrated circuit (IC) package construct...
The various embodiments of the present invention provide a novel chip-last embedded structure, where...
L’intégration hétérogène de circuits électroniques sur un interposeur silicium offre de nouvelles pe...