Until recently, lead-containing alloys were used widely in electronic and automotive industry. However, with the implementation of European union environmental directives, the use of such alloys has become prohibited. In this work we have studied various eutectic system like Sn-8.8 wt. % Zn, Sn-3.5 wt. % Ag and Sn-43 wt. % Bi and Sn-0.7 Cu to find best alternative of Sn-Pb solder alloy. Further we have studied the effect of Ni addition on the properties of Sn-0.7Cu solder alloy. The characterization of microstructure was done by optical as well as SEM. Energy Dispersive X- ray spectroscopy was done in order to find the various component present in the solder alloy. In order to find the melting point Differential scanning calorimetry was don...
The present work aimed at investigating the properties of Sn-Zn and Sn-Ag solder alloys and extensiv...
With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the e...
The development of lead-free solders has emerged as one of the key issues in the electronics packagi...
In recent years environmental legislation has specifically targeted the widespread use of lead in th...
As soldering controls the effective usage and processing of electronic components in ap...
Lead free solders are expected to replace the traditional Sn-Pb alloys due to environmental concern....
The current work explores the effects of a small addition of Ni on the microstructure and mechanical...
The current work explores the effects of a small addition of Ni on the microstructure and mechanical...
This paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm) on ...
Because of the environmental health implications of Pb, and legislation backing Restriction on Hazar...
The development of lead-free solders has emerged as one of the key issues in the electronics packagi...
Soldering alloys based oft the Sn-Cu alloy system are amongst the most favourable lead-free alternat...
Before the legislations against the usage of lead, Sn-Pb solders were considered as the most efficie...
The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to th...
Abstract-- The issues to substitute Tin-Lead Solders revolves around the health and environmental ha...
The present work aimed at investigating the properties of Sn-Zn and Sn-Ag solder alloys and extensiv...
With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the e...
The development of lead-free solders has emerged as one of the key issues in the electronics packagi...
In recent years environmental legislation has specifically targeted the widespread use of lead in th...
As soldering controls the effective usage and processing of electronic components in ap...
Lead free solders are expected to replace the traditional Sn-Pb alloys due to environmental concern....
The current work explores the effects of a small addition of Ni on the microstructure and mechanical...
The current work explores the effects of a small addition of Ni on the microstructure and mechanical...
This paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm) on ...
Because of the environmental health implications of Pb, and legislation backing Restriction on Hazar...
The development of lead-free solders has emerged as one of the key issues in the electronics packagi...
Soldering alloys based oft the Sn-Cu alloy system are amongst the most favourable lead-free alternat...
Before the legislations against the usage of lead, Sn-Pb solders were considered as the most efficie...
The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to th...
Abstract-- The issues to substitute Tin-Lead Solders revolves around the health and environmental ha...
The present work aimed at investigating the properties of Sn-Zn and Sn-Ag solder alloys and extensiv...
With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the e...
The development of lead-free solders has emerged as one of the key issues in the electronics packagi...