The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of lenses suspended in a polymer deposited or attached over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses ...
Embodiments of the invention relate to an apparatus including a light source to generate a plurality...
Methods, apparatus and systems for an up-converter resonant cavity light emitting diode device inclu...
In accordance with the invention, an LED packaged for high temperature operation comprises a metal b...
The present invention provides an electronic apparatus, such as a lighting device comprised of light...
The present invention provides a method of manufacturing an electronic apparatus, such as a lighting...
In accordance with the invention, an illumination device comprises a substrate (103) having a surfac...
A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a sem...
Visible light LEDs are produced having a layer of conjugated polymer which is cast directly from sol...
An optical light engine is fabricated by providing a thermally conductive base having one or more mo...
Some implementations provide a device (e.g., solar panel) that includes an active layer and a solar ...
A photovoltaic device includes one or more structures, an array of at least one of quantum dots and ...
—We have interfaced an array of polymer light emitting diodes (OLEDs) fabricated onto a glass subst...
Photon absorption, and thus current generation, is hindered in conventional thin-film solar cell des...
A laser (15) is mounted on a planar surface of a monocrystalline silicon mounting member (12). A sph...
A light emitting diode with improved light collimation comprises a substrate-supported LED die dispo...
Embodiments of the invention relate to an apparatus including a light source to generate a plurality...
Methods, apparatus and systems for an up-converter resonant cavity light emitting diode device inclu...
In accordance with the invention, an LED packaged for high temperature operation comprises a metal b...
The present invention provides an electronic apparatus, such as a lighting device comprised of light...
The present invention provides a method of manufacturing an electronic apparatus, such as a lighting...
In accordance with the invention, an illumination device comprises a substrate (103) having a surfac...
A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a sem...
Visible light LEDs are produced having a layer of conjugated polymer which is cast directly from sol...
An optical light engine is fabricated by providing a thermally conductive base having one or more mo...
Some implementations provide a device (e.g., solar panel) that includes an active layer and a solar ...
A photovoltaic device includes one or more structures, an array of at least one of quantum dots and ...
—We have interfaced an array of polymer light emitting diodes (OLEDs) fabricated onto a glass subst...
Photon absorption, and thus current generation, is hindered in conventional thin-film solar cell des...
A laser (15) is mounted on a planar surface of a monocrystalline silicon mounting member (12). A sph...
A light emitting diode with improved light collimation comprises a substrate-supported LED die dispo...
Embodiments of the invention relate to an apparatus including a light source to generate a plurality...
Methods, apparatus and systems for an up-converter resonant cavity light emitting diode device inclu...
In accordance with the invention, an LED packaged for high temperature operation comprises a metal b...