CuSn is an important intermetallic for electric interconnects and anode material of Li-ion batteries, with a polymorphic transformation from hexagonal eta-CuSn at temperatures higher than 186 °C to monoclinic eta′-CuSn at lower temperatures. The polymorphic transformation of CuSn has the potential to generate internal stresses in soldered joints during both the soldering process and subsequent device operation involving thermal cycling. Here we developed a systematic method to characterise the polymorphic transformations at localised points in a single grain of CuSn that is in intimate contact with adjacent Sn rich and CuSn phases to establish a time–temperature transformation (TTT) diagram of the eta to eta′-CuSn transformation. The method...
The growth mechanisms of primary Cu6Sn5 are studied in Sn-Cu alloys and solder joints by combining E...
Data availability: The raw/processed data required to reproduce these findings cannot be shared at t...
Abstract With the development of high-integration and high-power electronics, the lack of matching c...
In-situ observations of the polymorphic transformation in a single targeted Cu₆Sn₅ grain constrained...
CuSn is an important intermetallic compound used in lead-free soldering and anode materials for Li-i...
In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained...
Direct evidence of the relationship between the polymorphic phase transformation from monoclinic CuS...
The intermetallic compound Cu Sn is a significant microstructural feature of many electronic devices...
The polymorphic transformation in interfacial intermetallic compounds in three lead-free solder join...
Cu Sn is a critical intermetallic compound in soldering operations. Conventional equilibrium phase d...
International audienceThe copper rich corner of the CuNiSn system is frequently studied for the high...
As the most common of the intermetallic compounds (IMCs) formed between Sn-based solders and Cu subs...
The growth mechanisms of primary CuSn are studied in Sn-Cu alloys and solder joints by combining EBS...
Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are compose...
The growth of Cu-Sn intermetallic compounds (IMCs) at the molten Pb-Sn solder/Cu interface was studi...
The growth mechanisms of primary Cu6Sn5 are studied in Sn-Cu alloys and solder joints by combining E...
Data availability: The raw/processed data required to reproduce these findings cannot be shared at t...
Abstract With the development of high-integration and high-power electronics, the lack of matching c...
In-situ observations of the polymorphic transformation in a single targeted Cu₆Sn₅ grain constrained...
CuSn is an important intermetallic compound used in lead-free soldering and anode materials for Li-i...
In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained...
Direct evidence of the relationship between the polymorphic phase transformation from monoclinic CuS...
The intermetallic compound Cu Sn is a significant microstructural feature of many electronic devices...
The polymorphic transformation in interfacial intermetallic compounds in three lead-free solder join...
Cu Sn is a critical intermetallic compound in soldering operations. Conventional equilibrium phase d...
International audienceThe copper rich corner of the CuNiSn system is frequently studied for the high...
As the most common of the intermetallic compounds (IMCs) formed between Sn-based solders and Cu subs...
The growth mechanisms of primary CuSn are studied in Sn-Cu alloys and solder joints by combining EBS...
Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are compose...
The growth of Cu-Sn intermetallic compounds (IMCs) at the molten Pb-Sn solder/Cu interface was studi...
The growth mechanisms of primary Cu6Sn5 are studied in Sn-Cu alloys and solder joints by combining E...
Data availability: The raw/processed data required to reproduce these findings cannot be shared at t...
Abstract With the development of high-integration and high-power electronics, the lack of matching c...