In this paper, we present the Immediate Neighbourhood Temperature (INT) routing algorithm which balances thermal profiles across dynamically-throttled 3D NoCs by adaptively routing interconnect traffic based on runtime temperature monitoring. INT avoids the overheads of system-wide temperature monitoring by relying on the heat transfer characteristics of 3D integrated circuits which enable temperature information from routers in the immediate neighbourhood to guide adaptive routing decisions. Experimental results indicate that INT yields balanced thermal profiles with upto 25% lower gradients than competing schemes, and shortens communication latencies by decreasing average network congestion by upto 50%, with negligible overheads
For most of the history of computing, transistors have been expensive while wires have been cheap. C...
Due to the constraints on VLSI scaling and reliability of chips, future processor and system-on-chip...
Thermal issue is one of the major challenges in the research field of three-dimensional (3D) IC. Net...
In this paper, we present the Immediate Neighbourhood Temperature (INT) routing algorithm which bala...
3D Network-on-Chip NoC based systems have severe thermal problems due to the stacking of dies and di...
Due to the tier architecture of 3D network-on-chip (3D-NoC), reducing the thermal hotspot within the...
Since the three-dimensional Network on Chip (3D NoC) uses through-silicon via technology to connect ...
Three dimensional (3D) integration technologies have a smaller footprint area of chip compared to th...
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit ...
In this work, we propose an application specific routing algorithm to reduce the hot-spot temperatur...
The substantial silicon density in 3D VLSI, albeit its numerous advantages, introduces serious therm...
Many-core systems connected by 3D Networks-on-Chip (NoC) are emerging as a promising computation eng...
As number of components on the semi-conductor industry is growing at a healthy rate, results in an i...
With technology advancement to the nanoscale level, 3D stacking of Integrated Circuits (ICs) provide...
Recently three-dimensional Networks-on-Chips (3D NoCs) rang-ing from regular to highly irregular top...
For most of the history of computing, transistors have been expensive while wires have been cheap. C...
Due to the constraints on VLSI scaling and reliability of chips, future processor and system-on-chip...
Thermal issue is one of the major challenges in the research field of three-dimensional (3D) IC. Net...
In this paper, we present the Immediate Neighbourhood Temperature (INT) routing algorithm which bala...
3D Network-on-Chip NoC based systems have severe thermal problems due to the stacking of dies and di...
Due to the tier architecture of 3D network-on-chip (3D-NoC), reducing the thermal hotspot within the...
Since the three-dimensional Network on Chip (3D NoC) uses through-silicon via technology to connect ...
Three dimensional (3D) integration technologies have a smaller footprint area of chip compared to th...
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit ...
In this work, we propose an application specific routing algorithm to reduce the hot-spot temperatur...
The substantial silicon density in 3D VLSI, albeit its numerous advantages, introduces serious therm...
Many-core systems connected by 3D Networks-on-Chip (NoC) are emerging as a promising computation eng...
As number of components on the semi-conductor industry is growing at a healthy rate, results in an i...
With technology advancement to the nanoscale level, 3D stacking of Integrated Circuits (ICs) provide...
Recently three-dimensional Networks-on-Chips (3D NoCs) rang-ing from regular to highly irregular top...
For most of the history of computing, transistors have been expensive while wires have been cheap. C...
Due to the constraints on VLSI scaling and reliability of chips, future processor and system-on-chip...
Thermal issue is one of the major challenges in the research field of three-dimensional (3D) IC. Net...