Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds
- Xu, H
- Liu, C
- Silberschmidt, V V
- Pramana, Stevin S
- White, Timothy
- Chen, Z
- Acoff, V L
Publication date
February 2016
DOI Publisher
Elsevier BV ISSN
1359-6454 Journal
Acta Materialia Citation count (estimate)
116Abstract
Nanoscale interfacial evolution in Cu-Al wire bonds during isothermal annealing from 175 °C to 250 °C was investigated by high resolution transmission electron microscopy (HRTEM). The native aluminum oxide film (∼5 nm thick) of the Al pad migrates to
Add to ORKG