This paper describes the crystallochemical mechanisms that underpin the migration of nano-size alumina, intermetallic growth and phase transformations in Au-Al wire bonds during annealing from 175 °C to 250 °C by utilizing high-resolution transmission
This study investigates the microstructure across the interconnection zone of IN718/Al/IN718 couples...
Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to...
Thermosonic ball bonding is a key technology in electrical interconnections between an integrated ci...
This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution trans...
The paper is focused on the Au-Al intermetallic compound (IMC) formation and growth as well as the v...
Gold wire bonding on aluminum pads plays still an important role in microelectronic packaging. The l...
Nanoscale interfacial evolution in Cu-Al wire bonds during isothermal annealing from 175 °C to 250 °...
Palladium-doped and (Cu, Pt)-doped high reliability gold wires were used to form wire bond interconn...
Al-Au system has drawn a lot of research interests due to its wide use in microelectronic packaging ...
[[abstract]]In integrated-circuit packages, wire-bonding techniques are the preferred methods for ma...
There are several issues related to the mechanical and electrical wirebond failure during wirebondin...
Activation energies, Ea, measured from molecular exchange experiments are combined with atomic-scale...
Activation energies, Ea, measured from molecular exchange experiments are combined with atomic-scale...
AbstractA common joining method in microelectronics is thermosonic bonding of gold wires to aluminiu...
Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high te...
This study investigates the microstructure across the interconnection zone of IN718/Al/IN718 couples...
Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to...
Thermosonic ball bonding is a key technology in electrical interconnections between an integrated ci...
This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution trans...
The paper is focused on the Au-Al intermetallic compound (IMC) formation and growth as well as the v...
Gold wire bonding on aluminum pads plays still an important role in microelectronic packaging. The l...
Nanoscale interfacial evolution in Cu-Al wire bonds during isothermal annealing from 175 °C to 250 °...
Palladium-doped and (Cu, Pt)-doped high reliability gold wires were used to form wire bond interconn...
Al-Au system has drawn a lot of research interests due to its wide use in microelectronic packaging ...
[[abstract]]In integrated-circuit packages, wire-bonding techniques are the preferred methods for ma...
There are several issues related to the mechanical and electrical wirebond failure during wirebondin...
Activation energies, Ea, measured from molecular exchange experiments are combined with atomic-scale...
Activation energies, Ea, measured from molecular exchange experiments are combined with atomic-scale...
AbstractA common joining method in microelectronics is thermosonic bonding of gold wires to aluminiu...
Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high te...
This study investigates the microstructure across the interconnection zone of IN718/Al/IN718 couples...
Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to...
Thermosonic ball bonding is a key technology in electrical interconnections between an integrated ci...
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