[[alternative]]Anodic Bonding for Felid Emission Display Spacer Study

碩士機電工程學系[[abstract]]本研究係利用陽極接合法，針對不同鍍膜處理後之玻璃基板，將Soda lime玻璃與濺鍍Al/Cr/ITO玻璃進行接合強度評估；藉由調變介質薄膜厚度、接合溫度及接合電壓，討論不同鋁/鉻薄膜特性對空間支撐器整體接合強度之影響。實驗中，利用原子力顯微鏡來分析鋁/鉻薄膜表面形貌，接合面積利用光學顯微鏡搭配影像處理軟體觀察，接合界面元素分佈利用能量散佈光譜分析儀，接合強度利用剪應力破壞實驗測試，利用掃描式電子顯微鏡來觀察破斷面。經由實驗結果，較高的接合溫度、電壓及適當的膜厚皆能獲得最大的接合電流值、電荷量、接合面積比率及接合強度。此外，經由界面元素分析得知，接合鍵結的主要控制機制可能為O-離子，與鋁、鉻金屬離子之交互作用有關，而與錫、銦金屬離子無關。搭配濕式蝕刻製作之空間支撐器接合置具，可實際成功應用於場發射顯示器之空間支撐器接合。最佳接合參數為：薄膜厚度300nm、接合溫度300℃、接合電壓700V。 關鍵字：陽極接合、濺鍍、場發射顯示器、空間支撐器[[abstract]]The study the utilize of anodic bonding method, aims sputtering the glass substrate plate with treated differently, the Soda lime glass with sputtering and the Al/Cr/ITO glass to proceed on the assessment of bonding strength; by adjusting medium the film thickness, bonding temperature and bonding voltage, In order to discuss different influence on the bonding strength of whole the spacer of Al/Cr thin film characteristic .In the experiment, utilize of to Atomic Force Microscope to analysis Al/Cr surface shape thin film, the bonding area observation is estimated using an optical microscope to match the image and the software to observe, the element dispersal inside the bonding interface is analyzed using an energy dispersive spectrometer, bonding strength utilize shear stress to destroy the experiment to test, the broken section makes use of scanning electron microscope to observe . Via the experimental result, higher temperature , voltage and proper film of are thickness can all get the higher largest electric current value, electric charge amount, the rate of area and the bonding strength. In addition, via the interface analyse that learns, main controlling mechanism that the bond key forms may be O- ion, the reciprocation to Al , Cr metal atom has something relevant, and Sn, In metal atom have nothing relevant. Match the spacer device bonding where the wet etching and made to put, Succeed in applying to Field Emission Display the feasibility of the completion to bond spacer experiment actually .The best parameter is：300nm film thickness, bonding temperature of 300℃,and bonding voltage of 700V,respectively. Keyword：Anodic bonding、Sputtering、Field Emission Display、Space