A simple device-level characterization approach to quantitatively evaluate the impacts of different random variation sources in FinFETs is proposed. The impacts of random dopant fluctuation are negligible for FinFETs with lightly doped channel, leaving metal gate granularity and line-edge roughness as the two major random variation sources. The variations of V-th induced by these two major categories are theoretically decomposed based on the distinction in physical mechanisms and their influences on different electrical characteristics. The effectiveness of the proposed method is confirmed through both TCAD simulations and experimental results. This letter can provide helpful guidelines for variation-aware technology development.863 Project...
Line-edge roughness induced fin-edge roughness (FER) is the primary source of V-T variation in FinFE...
FinFETs operated with varying bias, and in particular with Short-circuited Gates (SG) or Independent...
This paper presents a comprehensive simulation study of the interactions between long-range process ...
A simple device-level characterization approach to quantitatively evaluate the impacts of different ...
A simple device-level characterization method to decompose the amplitudes of different random variat...
Predictive compact models for two key variability sources in FinFET technology, the gate edge roughn...
Predictive compact models for two key variability sources in FinFET technology, the gate edge roughn...
session: nanoelectronic devicesInternational audienceWe expanded our analytical compact model for th...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...
none4Short-range process variations such as line-edge roughness (LER) and random dopant fluctuations...
FinFETs may start to replace planar MOSFETs for specific applications at the 32nm node and beyond du...
We report the numerical simulation study on the characteristic variability of 10-nm SOI Multi Fin n-...
In this work, three dimensional technology computer-aided design (TCAD) simulations are performed to...
Threshold voltage ðVT Þ and drive current ðIONÞ variability of low stand-by power (LSTP)-32 nm FinFE...
A compact model to correlate FinFET device variability to the spatial fluctuation of fin-width is de...
Line-edge roughness induced fin-edge roughness (FER) is the primary source of V-T variation in FinFE...
FinFETs operated with varying bias, and in particular with Short-circuited Gates (SG) or Independent...
This paper presents a comprehensive simulation study of the interactions between long-range process ...
A simple device-level characterization approach to quantitatively evaluate the impacts of different ...
A simple device-level characterization method to decompose the amplitudes of different random variat...
Predictive compact models for two key variability sources in FinFET technology, the gate edge roughn...
Predictive compact models for two key variability sources in FinFET technology, the gate edge roughn...
session: nanoelectronic devicesInternational audienceWe expanded our analytical compact model for th...
Intra-die fluctuations in the nanoscale CMOS technology emerge inherently to geometrical variations ...
none4Short-range process variations such as line-edge roughness (LER) and random dopant fluctuations...
FinFETs may start to replace planar MOSFETs for specific applications at the 32nm node and beyond du...
We report the numerical simulation study on the characteristic variability of 10-nm SOI Multi Fin n-...
In this work, three dimensional technology computer-aided design (TCAD) simulations are performed to...
Threshold voltage ðVT Þ and drive current ðIONÞ variability of low stand-by power (LSTP)-32 nm FinFE...
A compact model to correlate FinFET device variability to the spatial fluctuation of fin-width is de...
Line-edge roughness induced fin-edge roughness (FER) is the primary source of V-T variation in FinFE...
FinFETs operated with varying bias, and in particular with Short-circuited Gates (SG) or Independent...
This paper presents a comprehensive simulation study of the interactions between long-range process ...