This article reports the impact of nanovoids on macro-properties and its underlying physical mechanism in nanotwinned Cu films with nanovoids synthesized via magnetron sputtering. The results indicate the resistivity due to nanovoids is proportional to void porosity at 4 K and the film hardness induced by nanovoids is proportional to void density in the slip plane while independent of void sizes. The ratio of hardness to resistivity is thus able to be improved by tuning nanovoids based on above findings. These findings will definitely provide references for the future study on the improvement of materials' properties synthesized by sputtering deposition techniques. (C) 2017 Acta Materialia Inc Published by Elsevier Ltd. All rights rese...
Cu thin films are nowadays attractive components for emergent MEMS based technologies because their ...
Evidence for existence of composite copper/oxygen vacancy nanofilaments is presented. The composite ...
Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials ...
Cu films with high mechanical strength and low electrical resistivity are required in various indust...
Epitaxial nanotwinned Cu films, with an average twin spacing ranging from 7 to 16 nm, exhibit a high...
The focus of this research is the development of high strength, high conductivity copper films. Pure...
abstract: With the advancements in technology, it is now possible to synthesize new materials with s...
Glancing Angle Deposition (GLAD) based Cu nanospring films are a promising form of film that combine...
Purpose – The purpose of this paper is to obtain a multidisciplinary characterization of nanostructu...
This paper discusses a new method of powder-metallurgy processing to produce regular-structured Cu n...
Understanding the behavior of materials with nanoscale features is important because of both the siz...
Tensile tests were carried on the electroplated Cu films with various densities of twin grain bounda...
An initial study to investigate the effect of controlled deposition of nanoparticles at multilayer i...
2014-04-11Metals containing high densities of nanoscale growth twins have shown potential as an alte...
In this article we report the results of the scanning tunneling microscope study of the surface morp...
Cu thin films are nowadays attractive components for emergent MEMS based technologies because their ...
Evidence for existence of composite copper/oxygen vacancy nanofilaments is presented. The composite ...
Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials ...
Cu films with high mechanical strength and low electrical resistivity are required in various indust...
Epitaxial nanotwinned Cu films, with an average twin spacing ranging from 7 to 16 nm, exhibit a high...
The focus of this research is the development of high strength, high conductivity copper films. Pure...
abstract: With the advancements in technology, it is now possible to synthesize new materials with s...
Glancing Angle Deposition (GLAD) based Cu nanospring films are a promising form of film that combine...
Purpose – The purpose of this paper is to obtain a multidisciplinary characterization of nanostructu...
This paper discusses a new method of powder-metallurgy processing to produce regular-structured Cu n...
Understanding the behavior of materials with nanoscale features is important because of both the siz...
Tensile tests were carried on the electroplated Cu films with various densities of twin grain bounda...
An initial study to investigate the effect of controlled deposition of nanoparticles at multilayer i...
2014-04-11Metals containing high densities of nanoscale growth twins have shown potential as an alte...
In this article we report the results of the scanning tunneling microscope study of the surface morp...
Cu thin films are nowadays attractive components for emergent MEMS based technologies because their ...
Evidence for existence of composite copper/oxygen vacancy nanofilaments is presented. The composite ...
Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials ...