3D helical mesostructures are attractive for applications in a broad range of microsystem technologies due to their mechanical and electromagnetic properties as stretchable interconnects, radio frequency antennas, and others. Controlled compressive buckling of 2D serpentine-shaped ribbons provides a strategy to formation of such structures in wide ranging classes of materials (from soft polymers to brittle inorganic semiconductors) and length scales (from nanometer to centimeter), with an ability for automated, parallel assembly over large areas. The underlying relations between the helical configurations and fabrication parameters require a relevant theory as the basis of design for practical applications. Here, an analytic model of compre...
Future advances in materials will be aided by improved dimensional control in fabrication of 3D hier...
Development of schemes to form complex three-dimensional (3D) mesostructures in functional materials...
Recently developed methods in mechanically guided assembly provide deterministic access to wide-rang...
Three-dimensional (3D) helical mesostructures are attractive for applications in a broad range of mi...
Mechanically guided assembly through buckling-induced two-dimensional (2D)-to- three-dimensional (3D...
Formation of 3D mesostructures in advanced functional materials is of growing interest due to the wi...
Capabilities for assembly of three-dimensional (3D) micro/nanostructures in advanced materials have ...
Lightweight structures directly contribute to the sustainability of aviation, as their use reduces t...
Techniques for forming sophisticated, 3D mesostructures in advanced, functional materials are of rap...
AbstractHigh-performance stretchable electronics have to utilize high-quality inorganic electronic m...
Approaches capable of creating 3D mesostructures in advanced materials (device-grade semiconductors,...
Recently developed methods in mechanically guided assembly provide deterministic access to wide-rang...
Approaches capable of creating 3D mesostructures in advanced materials (device-grade semiconductors,...
Recently experimentally synthesized three-dimensional (3D) MoS₂MoS₂ spiral is a new kind of helical ...
The need for mechanical metamaterials with large strain range and lightweight properties are evidenc...
Future advances in materials will be aided by improved dimensional control in fabrication of 3D hier...
Development of schemes to form complex three-dimensional (3D) mesostructures in functional materials...
Recently developed methods in mechanically guided assembly provide deterministic access to wide-rang...
Three-dimensional (3D) helical mesostructures are attractive for applications in a broad range of mi...
Mechanically guided assembly through buckling-induced two-dimensional (2D)-to- three-dimensional (3D...
Formation of 3D mesostructures in advanced functional materials is of growing interest due to the wi...
Capabilities for assembly of three-dimensional (3D) micro/nanostructures in advanced materials have ...
Lightweight structures directly contribute to the sustainability of aviation, as their use reduces t...
Techniques for forming sophisticated, 3D mesostructures in advanced, functional materials are of rap...
AbstractHigh-performance stretchable electronics have to utilize high-quality inorganic electronic m...
Approaches capable of creating 3D mesostructures in advanced materials (device-grade semiconductors,...
Recently developed methods in mechanically guided assembly provide deterministic access to wide-rang...
Approaches capable of creating 3D mesostructures in advanced materials (device-grade semiconductors,...
Recently experimentally synthesized three-dimensional (3D) MoS₂MoS₂ spiral is a new kind of helical ...
The need for mechanical metamaterials with large strain range and lightweight properties are evidenc...
Future advances in materials will be aided by improved dimensional control in fabrication of 3D hier...
Development of schemes to form complex three-dimensional (3D) mesostructures in functional materials...
Recently developed methods in mechanically guided assembly provide deterministic access to wide-rang...