Research oh flexible thermal interface materials (TIMs) has shown that the interconnected network of graphene foam (GF) offers effective paths of heat transportation. In this work, a variant amount of multilayer graphene flakes (MGFs) was added into 0.2 vol% GF/polydimethylsiloxane (PDMS) composite. A remarkable synergistic effect between MGF and GF in improving thermal conductivity of polymer composites is achieved. With 2.7 vol% MGFs, the thermal conductivity of MGF/GF/PDMS composite reaches 1.08 W m(-1) K-1, which is 80%, 184% and 440% higher than that of 2.7 vol% MGF/PDMS, GF/PDMS composites and pure PDMS, respectively. The MGF/GF/PDMS composite also shows superior thermal stability. The addition of MGFs and GF decreases slightly the el...
The thermal insulating properties of polymer greatly restrict the application of polymer as the ther...
In this work, the role of graphene flake size on the properties of poly(vinylidene fluoride-co-hexaf...
The substantial heat generation in highly dense electronic devices requires the use of materials tai...
A series of novel polymer composites consisting of graphene foam (GF), carbon black (CB) and polydim...
This paper presents the improved thermal property of three-dimensional (3D) graphene network modifie...
To meet the increasing demands for effective heat management of electronic devices, a graphene-based...
The effect of carbon fibre (CF) on the mechanical and thermal properties of graphene foam (GF)/polyd...
To meet the increasing demands for effective heat management of electronic devices, a graphene-based...
Owing to the unique thermal transfer property, graphene attracts great attention as heat dissipation...
With the integration and miniaturization of electronic devices, thermal management has become a cruc...
Highly thermal conductive thermal interface materials are playing an irreplaceable role in modern hi...
In this work, the thermal behavior of graphene foam (GF) filled polymer composite is investigated us...
The exceptional thermal conductivity of graphene is expected to endow polymer composites with ultrah...
Recently, multifunctional polymer-graphene nanoplatelet (GnP) composites have demonstrated great pro...
Recently, multifunctional polymer-graphene nanoplatelet (GnP) composites have demonstrated great pro...
The thermal insulating properties of polymer greatly restrict the application of polymer as the ther...
In this work, the role of graphene flake size on the properties of poly(vinylidene fluoride-co-hexaf...
The substantial heat generation in highly dense electronic devices requires the use of materials tai...
A series of novel polymer composites consisting of graphene foam (GF), carbon black (CB) and polydim...
This paper presents the improved thermal property of three-dimensional (3D) graphene network modifie...
To meet the increasing demands for effective heat management of electronic devices, a graphene-based...
The effect of carbon fibre (CF) on the mechanical and thermal properties of graphene foam (GF)/polyd...
To meet the increasing demands for effective heat management of electronic devices, a graphene-based...
Owing to the unique thermal transfer property, graphene attracts great attention as heat dissipation...
With the integration and miniaturization of electronic devices, thermal management has become a cruc...
Highly thermal conductive thermal interface materials are playing an irreplaceable role in modern hi...
In this work, the thermal behavior of graphene foam (GF) filled polymer composite is investigated us...
The exceptional thermal conductivity of graphene is expected to endow polymer composites with ultrah...
Recently, multifunctional polymer-graphene nanoplatelet (GnP) composites have demonstrated great pro...
Recently, multifunctional polymer-graphene nanoplatelet (GnP) composites have demonstrated great pro...
The thermal insulating properties of polymer greatly restrict the application of polymer as the ther...
In this work, the role of graphene flake size on the properties of poly(vinylidene fluoride-co-hexaf...
The substantial heat generation in highly dense electronic devices requires the use of materials tai...