With the development of MEMS technology, especially the development of packaging technology, more and more MEMS devices require the vacuum packaging to improve their performances. However, MEMS vacuum packaging technology has been a technical problem for many years. Currently, we still can't truly achieve the low leakage rate vacuum packaging of MEMS devices. Meanwhile, the existing detecting method can't accurately measure low leakage rate. For these reasons, this paper carried out a novel test method to detect the low leakage rate of MEMS vacuum packaging. The use of a crystal to real-time monitoring the vacuum level inside of the envelope to get indirect leakage rate of the envelope was proposed. Through the work of crystal cal...
Hermeticity is a measure of how well a package can maintain its intended ambient cavity environment...
Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor struc...
Developing packaging technology is one of the most important tasks to improve the performance of MEM...
Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, ...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, ...
MEMS (Micro Electro Mechanical Systems) are micro machines, i.e. freestanding very small devices tha...
Many MEMS (Micro Electro-Mechanic Systems) parts have to meet the requirements for vacuum packaging....
MEMS (Micro Electro Mechanical Systems) are micro machines, i.e. freestanding very small devices tha...
This chapter discusses the Hermicity Tests in detail. Hermeticity testing is a technology that deals...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
Vacuum packaging is used extensively in MEMS sensors for improving performance. However, the vacuum ...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...
Hermeticity is a measure of how well a package can maintain its intended ambient cavity environment...
Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor struc...
Developing packaging technology is one of the most important tasks to improve the performance of MEM...
Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, ...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, ...
MEMS (Micro Electro Mechanical Systems) are micro machines, i.e. freestanding very small devices tha...
Many MEMS (Micro Electro-Mechanic Systems) parts have to meet the requirements for vacuum packaging....
MEMS (Micro Electro Mechanical Systems) are micro machines, i.e. freestanding very small devices tha...
This chapter discusses the Hermicity Tests in detail. Hermeticity testing is a technology that deals...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
Vacuum packaging is used extensively in MEMS sensors for improving performance. However, the vacuum ...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...
Hermeticity is a measure of how well a package can maintain its intended ambient cavity environment...
Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor struc...
Developing packaging technology is one of the most important tasks to improve the performance of MEM...